423-pin (CUS) package image

AM3715CUS100 正在供货

Sitara 处理器: Arm Cortex-A8、3D 图形、摄像机

定价

数量 价格
+

出口管制分类

*仅供参考

  • 美国 ECCN:5A992C

封装信息

封装 | 引脚 FCCSP (CUS) | 423
工作温度范围 (°C) 0 to 90
包装数量 | 包装 90 | JEDEC TRAY (5+1)

AM3715 的特性

  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

AM3715 的说明

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

了解更多信息

可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

了解更多信息