ALPHA-XILINX-KU060-SPACE

Alpha Data® board for Xilinx® Kintex® UltraScale™ XQRKU060 FPGA with TI power

ALPHA-XILINX-KU060-SPACE

Order now

Overview

This is a development kit for the Xilinx® XQRKU060 FPGA with industrial -1 speed grade. ADA-SDEV-KIT2 has a modular board design with a XRTC-compatible configuration module, two FMC connectors, DDR3 DRAM, system monitoring, and space-grade TI power management and temperature-sensing solutions.

Buck converters (integrated switch)
TPS50601A-SP Radiation-hardness-assured (RHA), 3-V to 7-V input, 6-A synchronous step-down converter TPS7H4001-SP Radiation-hardness-assured (RHA), 3-V to 7-V input, 18-A, synchronous step-down converter

 

DDR memory power ICs
TPS7H3301-SP Radiation-hardness-assured (RHA) 3-A sink/source DDR termination linear regulator

 

Digital temperature sensors
TMP461-SP Radiation-hardness-assured (RHA), high-accuracy remote and local temperature sensor

 

Linear regulators (LDO)
TPS7H1101A-SP Radiation-hardness-assured (RHA), 1.5-V to 7-V input, 3-A low-noise low-dropout (LDO) regulator

Order & start development

Development kit

ADA-SDEV-KIT – Alpha Data® board for Xilinx® Kintex® UltraScale™ XQRKU060 FPGA with TI power

Version: v2
TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

No results found. Please clear your search and try again.
View all 18
Type Title Date
White paper Powering a New Era of High-Performance Space-Grade Xilinx FPGAs Mar. 29, 2021
Selection guide TI Space Products (Rev. H) Jan. 27, 2021
Radiation & reliability report TMP461-SP Total Ionizing Dose (TID) Report (Rev. C) Jan. 04, 2021
Radiation & reliability report Single-Event Effects Test Report for TMP461-SP High-Accuracy Remote and Local (Rev. B) Jan. 04, 2021
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations May 18, 2020
Application note Single-Event Effects Confidence Interval Calculations Jan. 14, 2020
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing Jun. 17, 2019
Radiation & reliability report TPS50601A-SP Total Ionizing Dose (TID) Radiation Report (Rev. B) May 30, 2019
Radiation & reliability report Single-Event Effects Test Report of the TPS50601A-SP Synch Step-Down Converter (Rev. A) Feb. 05, 2019
Radiation & reliability report TMP461-SP (5962R1721701VXC) Neutron Displacement Damage Characterization Sep. 10, 2018
Application note Use of an LDO as a Load Switch for Space Applications Aug. 01, 2018
Radiation & reliability report TPS50601A-SP (5962R1022102VSC) Neutron Displacement Damage Characterization (Rev. A) Jul. 24, 2018
Application note Conditional Stability in Feedback Systems Feb. 21, 2018
Radiation & reliability report TPS7H1101-SP Neutron Displacement Damage Characterization Report Oct. 23, 2017
Radiation & reliability report TPS7H3301-SP Single-Event Effects Radiation Report (Rev. A) Jan. 25, 2017
Application note External Soft-Start Circuit for TPS7H3301-SP Power-Up Sequencing Applications Jul. 07, 2016
Radiation & reliability report TPS7H3301-SP Total Ionizing Dose Radiation Report Jul. 01, 2016
Radiation & reliability report TPS7H1101‐SP TID and SEE Report (Rev. A) Apr. 27, 2015

Related design resources

Hardware development

EVALUATION BOARD
TMP461EVM-CVAL Radiation Hardness Assured (RHA) High-Accuracy Remote and Local Temperature Sensor Evaluation Module TPS50601ASPEVM-D TPS50601A-SP dual-operation evaluation module TPS50601ASPEVM-S TPS50601A-SP single-operation evaluation module TPS7H1101SPEVM TPS7H1101SPEVM Evaluation Module TPS7H3301EVM-CVAL TPS7H3301-SP DDR Termination Evaluation Module TPS7H4001EVM-CVAL 1-channel, 18-A, 3-V to 7-V input, synchronous step-down converter evaluation module TPS7H4001QEVM-CVAL 4-channel, 72-A, 3-V to 7-V input, synchronous step-down converter evaluation module

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Alpha Data Parallel Systems Ltd..

Videos

Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.