Telecom Bus Converter for Module Replacement


Design files


Highest performance, highest power 175W telecom active clamp forward, 5V @35A w/ lowest form factor

  • Adding active clamp and sync rectifiers improves efficiency of forward (and flyback) up to 5% (Efficiencies >90%, here up to 95%)
  • Forward provides best efficiency due to lower conduction losses than flyback
  • Forward can be scaled to higher output power with similar results
  • Flyback for multiple outputs or when cost is most important
Output voltage options PMP5711.1
Vin (Min) (V) 36
Vin (Max) (V) 72
Vout (Nom) (V) 5
Iout (Max) (A) 35
Output Power (W) 175
Isolated/Non-Isolated Isolated
Input Type DC
Topology Forward- Active Clamp
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDU185.PDF (1605 K)

Test results for the reference design, including efficiency graphs, test prerequisites and more

SLUU814.PDF (692 K)

Test results for the reference design, including efficiency graphs, test prerequisites and more

SLUR775.PDF (67 K)

Detailed schematic diagram for design layout and components

SLUR776.PDF (26 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDC221.ZIP (101 K)

Design file that contains information on physical board layer of design PCB

TIDU184.PDF (587 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

N-channel MOSFETs

CSD17312Q530-V, N channel NexFET™ power MOSFET, single SON 5 mm x 6 mm, 1.7 mOhm

Data sheet: PDF
PWM controllers

UCC2897A110-V active clamp current mode PWM controller with P-channel clamp FET and line OV protection

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
Test report PMP5711 Active Clamp Technology Presentation Dec. 18, 2013
Test report PMP5711 Test Results Nov. 23, 2011

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