This reference design features a highly modular design for radiation-hardened satellite telemetry systems that utilizes the versatility of LMP7704-SP to accurately monitor temperature, voltage and current to provide feedback to the host board. It also provides controlled analog outputs to provide protection and optimal efficiency. The majority of space applications require monitoring of these three key measurables in multiple sub-systems of the satellite.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
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Reference design overview and verified performance test data
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | Versatile Satellite Health Monitoring & Control Platform Ref. Des. W/ < 1% Acc. | PDF | HTML | Jul. 28, 2021 |
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