This reference design is built keeping an electronic imaging system in mind. Image sensors today force heavy demands on ADCs in terms of: excellent linearity (DNL < 0.5 LSB and INL < 4 LSB), high resolution (12- to 18-bit), high speed (up to 20 MSPS), and high SNR (> 74-dB SNR) to assure superior image quality and freedom from distortion over time. Enabled by the low-noise, high-speed amplifier, fully differential amplifier (FDA), high-speed ADC, and low-noise LDO from TI, this reference design demonstrates how to design a high-performance analog signal chain for digitizing the pixel-output signal in thermal imaging cameras.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
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Reference design overview and verified performance test data
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Detailed overview of design layout for component placement
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | 74-dB SNR, 10-MSPS, 14-Bit, Analog Front-End Reference Design for Thermal Imagin | Jul. 26, 2017 |
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