Man machine interaction requires an acoustic interface for providing full duplex hands-free communication. In hands-free mode, part of the far-end or near-end audio signal from the speaker is coupled to the microphones. Furthermore, in noisy environments the microphones also capture ambient noise in addition to the useful near-end audio signal. The captured multi-microphone audio signals are corrupted by acoustic background noise as well as by echoic signals that significantly degrade the intelligibility of the desired signal, and restrict the performance of subsequent audio processing systems. This reference design demonstrates dual microphones for audio input via stereo ADC, low-power DSP performing noise reduction, acoustic echo cancellation, and other audio quality enhancement algorithms. This design also features TI’s Smart Amp technology for high-quality and high-SPL audio output from a micro-speaker.
- Two-way audio modular platform supporting analog or digital microphone for audio capture and playback on micro-speaker using TI Smart Amp technology
- TLV320ADC3101 Stereo ADC with 92-dBA SNR, 0.003% THD integrated PGA , AGC, and mini-DSP for implementing decimation filtering
- Powerful TMS320C5517 DSP for implementing various audio processing algorithms like: Adaptive Spectral Noise Reduction (ASNR) and Acoustic Echo Cancellation (AEC) handling echo tails up-to 128ms
- Smart Amp TAS2557 with integrated ultra-lownoise audio DAC, class-D power amplifier and built-in speaker sensing/protection to deliver high
SPL using micro-speaker
- Attaches to AM335x-based BeagleBone™ Black Wireless to support optional Cloud connectivity