TIDM-TEMPCOMPENSATED-RTC

Microcontroller Based Temperature Compensated Real Time Clock Solution

TIDM-TEMPCOMPENSATED-RTC

Design files

Overview

This report introduced the methodology to implement an ultra low power real time clock with temperature compensation function in MSP430F6736. This report describes the crystal’s temperature characteristics and posts to use MSP430F6736’s RTC_C module plus software to implement a ultra low power RTC, with automatic temperature compensation feature and second ticks generation function. This report finally builds up reference code which runs in MSP430F6736 and provides test result.

Features
  • MSP430F6736 is highly flexible and powerful single chip mixed signal measurement device
  • On chip RTC_C module and ADC10 for realize ultra low power and high accuracy RTC calendar
  • Instead of expensive dedicated RTC chip,reduce the cost for E-Meter application
  • High integration chip ideal for single chip smart electricity meter solution
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDU600.PDF (1099 K)

Reference design overview and verified performance test data

TIDRC10.PDF (63 K)

Detailed schematic diagram for design layout and components

TIDRC11.PDF (136 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDC794.ZIP (203 K)

Design file that contains information on physical board layer of design PCB

Products

Includes TI products in the design and potential alternatives.

RS-485 & RS-422 transceivers

SN65HVD3082EHalf-duplex RS-485 transceiver

Data sheet: PDF | HTML

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Software

Technical documentation

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Type Title Date
Design guide ULP Temperature Compensated RTC on MSP430F6736 Design Guide Jan. 06, 2015

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