[
{
"name": "Building the power foundation that AI data centers demand",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/building-the-power-foundation-that-AI-data-centers-demand.html",
"headline": "建構 AI 數據中心所需的電力基礎",
"subheadline": "重新審視傳統的電源設計方法，以實現從電網到閘極的全方位供電",
"image": "/content/dam/ticom/images/people/employees/on-site/jeff-morroni-keynote-computex.png",
"date": "09 10 月 2026",
"category": "科技"
},
{
"name": "Engineered to last: Powering the next generation of satellites",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/engineered-to-last-powering-the-next-generation-of-satellites.html",
"headline": "專為長久運作而設計：驅動新一代衛星發展",
"subheadline": "航太級IC的進展正重新定義衛星在軌道上多年穩定運作所需的條件",
"image": "/content/dam/ticom/images/applications/space/world-space-week.jpg",
"date": "05 10 月 2026",
"category": "科技"
},
{
"name": "數據中心產生的熱量達到前所未有的程度。 散熱技術必須跟上腳步。",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/data-centers-are-generating-more-heat-than-ever-cooling-has-to-keep-up.html",
"headline": "數據中心產生的熱量正達到前所未有的程度，散熱技術必須跟上腳步。",
"subheadline": "隨著 AI 對數據中心提出極端的電力需求，工程師正重新思考數據中心移動、監控與控制熱量的方式。",
"image": "/content/dam/ticom/images/applications/enterprise-system/data-center-cooling-thermal-management.jpg",
"date": "31 8 月 2026",
"category": "科技"
},
{
"name": "創新背後的故事：改寫電流感測技術之路",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/behind-the-innovation-the-road-to-rewriting-current-sensing.html",
"headline": "創新背後的故事：改寫電流感測技術之路",
"subheadline": "TI 工程師團隊如何攻克業界多年的兩難難題，打造首款專為牽引逆變器設計的多軸無磁芯霍爾效應感測器",
"image": "/content/dam/ticom/images/people/employees/on-site/tmcs2100-jason-cole-and-lei-ding-2.jpg",
"date": "25 8 月 2026",
"category": "科技"
},
{
"name": "將人形機器人帶入現實世界需要什麼？閱讀我們專家的見解",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/what-will-it-take-to-bring-humanoid-robots-into-the-real-world-read-our-experts-insights.html",
"headline": "將人形機器人部屬到現實世界需要什麼？",
"subheadline": "人形機器人是 AI 成為實體的一種方式，而半導體技術將助力機器人邁出下一步",
"image": "/content/dam/ticom/images/applications/factory-automation/humanoid-sensing-and-motor-control-in-factory.jpg",
"date": "24 6 月 2026",
"category": "科技"
},
{
"name": "可靠性將決定未來十年儲能的發展方向",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/reliability-will-define-the-next-decade-of-energy-storage.html",
"headline": "可靠性將決定未來十年儲能的發展方向",
"subheadline": "電池管理技術的進步使得電網級系統能夠實現更穩定的性能",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-energy-storage-system-at-sunset.jpg",
"date": "09 6 月 2026",
"category": "科技"
},
{
"name": "智慧底盤：改變汽車移動方式的無聲升級",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-intelligent-chassis-the-silent-upgrade-thats-changing-how-cars-move.html",
"headline": "智慧底盤：改變汽車移動方式的無聲升級",
"subheadline": "轉向、煞車和懸吊系統正走向電子化，這即將改變汽車的移動方式和乘坐感受",
"image": "/content/dam/ticom/images/applications/automotive/transparent-car-showing-an-intelligent-chassis.jpg",
"date": "01 6 月 2026",
"category": "科技"
},
{
"name": "改變世界的晶片",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-chips-that-change-the-world.html",
"headline": "改變世界的晶片",
"subheadline": "為何通用晶片能為那些正在重塑我們生活的技術創新奠定基礎",
"image": "/content/dam/ticom/images/applications/home-automation/smart-home-health-monitoring.jpg",
"date": "27 5 月 2026",
"category": "科技"
},
{
"name": "創新與影響力的交會點",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/where-innovation-meets-impact.html",
"headline": "創新與影響力的交會點",
"subheadline": "我們如何在職場推動創新，實踐成為社區友鄰的承諾，以及創造永續的未來",
"image": "/content/dam/ticom/images/literature/corporate/ccr-blog-r4-tw.jpg",
"date": "26 5 月 2026",
"category": "TI 的日常生活"
},
{
"name": "更智慧的斷路器，更安全的家園：能源豐沛住宅中的隱藏科技",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/smarter-breakers-safer-home-the-hidden-technology-within-your-energy-abundant-house.html",
"headline": "安全住家中的隱藏科技: 更智慧的斷路器",
"subheadline": "智慧電氣化如何幫助屋主管理能源消耗，過上更安全、更便利的生活",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/energized-home-overview.jpg",
"date": "26 5 月 2026",
"category": "科技"
},
{
"name": "未來自此起航：從實習生到全職 TI 員工的 3 個心得體會",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-future-starts-here-3-insights-on-the-journey-from-intern-to-full-time-TIer.html",
"headline": "未來自此啟航：從實習生到正職 TIer 的 3 個心得啟發",
"subheadline": "TIer 們回顧了那些開啟他們職業生涯的實習經歷，以及他們在實習過程中所學到的寶貴經驗。",
"image": "/content/dam/ticom/images/people/employees/on-site/pre-intern-blog-tw.jpg",
"date": "13 5 月 2026",
"category": "TI 的日常生活"
},
{
"name": "揭開 DSP 技術的發展歷程：兒童玩具如何引發邊緣人工智慧革命",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/uncovering-the-legacy-of-DSP-technology-how-a-childrens-toy-sparked-the-edge-AI-revolution.html",
"headline": "揭開 DSP 技術的發展歷程：兒童玩具如何引發邊緣人工智慧革命",
"subheadline": "了解 TI 如何憑藉 Speak & Spell* 奠定其在訊號處理領域的傳承，並透過現今具備邊緣 AI 功能的裝置持續創新。",
"image": "/content/dam/ticom/images/themes/circuits/invention-of-ai.jpg",
"date": "04 5 月 2026",
"category": "科技"
},
{
"name": "為什麼封裝是電源設計創新的下一個前沿",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/why-packaging-is-the-next-frontier-in-power-design-innovation.html",
"headline": "為什麼封裝技術是電源設計創新的下一個重點",
"subheadline": "由於電源系統在固定區域內需要更多的能力，封裝創新有助於實現更高的整合度、安全性和性能",
"image": "/content/dam/ticom/images/themes/circuits/ucc3141-isopack.jpg",
"date": "23 3 月 2026",
"category": "科技"
},
{
"name": "重新定義 EV 體驗的 3 種半導體技術",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-semiconductor-technologies-that-are-redefining-the-EV-experience.html",
"headline": "重新定義 EV 體驗的 3 種半導體技術",
"subheadline": "半導體技術如何將 EV 轉變為實用且日常的選擇",
"image": "/content/dam/ticom/images/people/employees/off-site/jerry-shi-charging-ev.jpg",
"date": "16 3 月 2026",
"category": "科技"
},
{
"name": "超越聲音：半導體創新如何改變音訊體驗",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/beyond-sound-how-semiconductor-innovation-is-transforming-audio-experiences.html",
"headline": "超越您對聲音的想像：半導體創新如何改變音訊體驗",
"subheadline": "音訊讓我們的生活更豐富、更具個人特色，甚至更安全。加上半導體技術的助攻後，還能創造哪些無限可能？",
"image": "/content/dam/ticom/images/applications/audio/asc-audio.jpg",
"date": "20 2 月 2026",
"category": "科技"
},
{
"name": "開創影響深遠的工程之路",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/engineering-a-path-with-impact.html",
"headline": "開創影響深遠的工程之路",
"subheadline": "TI 工程師回顧專業成長、解決問題、回饋社區，以及如何打造一份以創新驅動真實世界改變的職涯",
"image": "/content/dam/ticom/images/people/employees/on-site/engineers-in-a-lab-with-ashley-richmond.jpg",
"date": "19 2 月 2026",
"category": "TI 的日常生活"
},
{
"name": "測試精度",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/putting-precision-to-the-test.html",
"headline": "測試精度",
"subheadline": "半導體的進步如何推動測試設備的突破",
"image": "/content/dam/ticom/images/themes/circuits/precision-test-and-measurement.jpg",
"date": "16 2 月 2026",
"category": "科技"
},
{
"name": "3 項由半導體驅動的創新，正改變我們體驗世界的方式",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-semiconductor-enabled-innovations-impacting-how-we-experience-the-world.html",
"headline": "3 項由半導體驅動的創新，正改變我們體驗世界的方式",
"subheadline": "更安全的系統、更精巧的裝置以及更普及的 AI，將共同塑造明日的科技樣貌",
"image": "/content/dam/ticom/images/themes/concepts/woman-looking-at-connected-city.jpg",
"date": "31 12 月 2025",
"category": "科技"
},
{
"name": "塑造自動駕駛體驗的半導體技術",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-semiconductor-technology-shaping-the-autonomous-driving-experience.html",
"headline": "型塑自動駕駛體驗的半導體技術",
"subheadline": "未來的車輛將具備更高的自動化程度，讓駕駛變得更輕鬆。問題是設計工程師該如何實現這目標？",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-using-driver-assist-system.jpg",
"date": "05 12 月 2025",
"category": "科技"
},
{
"name": "以現今支援邊緣 AI 的裝置打造明日創新",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/building-tomorrows-innovations-with-todays-edge-AI-enabled-devices.html",
"headline": "以支援邊緣 AI 的裝置打造明日創新",
"subheadline": "邊緣 AI 技術正使裝置更高效、易於存取且更準確，而這僅正要開始",
"image": "/content/dam/ticom/images/applications/medical/ai-use-cases-medical-patch.jpg",
"date": "11 11 月 2025",
"category": "科技"
},
{
"name": "從電網到閘極：推動第三次能源革命",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/from-the-grid-to-the-gate-powering-the-third-energy-revolution.html",
"headline": "從電網到閘極：推動第三次能源革命",
"subheadline": "利用再生能源，滿足因為 AI 驅動的數據中心而日益增長的能源需求",
"image": "/content/dam/ticom/images/themes/circuits/dce-program-datacenter.jpg",
"date": "07 10 月 2025",
"category": "科技"
},
{
"name": "突破光罩限制：DLP® 技術如何透過先進封裝實現新型運算解決方案",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/beyond-the-mask-how-dlp-technology-is-enabling-new-computing-solutions-with-advanced-packaging.html",
"headline": "突破光罩限制：DLP® 技術如何透過先進封裝實現新型運算解決方案",
"subheadline": "半導體產業邁向先進封裝的趨勢，要求微影技術同步進化 —— 而 DLP 技術是實現這一變革的關鍵。 ",
"image": "/content/dam/ticom/images/applications/projection-display/dlp-digital-lithography.jpg",
"date": "30 9 月 2025",
"category": "科技"
},
{
"name": "精彩還在後面：未來突破中的積體電路傳承 ",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-best-is-yet-to-come-the-legacy-of-the-integrated-circuit-in-tomorrows-breakthroughs.html",
"headline": "最精彩的尚未到來：積體電路的傳承引領未來",
"subheadline": "Jack Kilby 發明的 IC 成為現代創新的無形基石，驅動著我們今日所依賴的技術，以及我們未來將依賴的技術。",
"image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-day-2025.jpg",
"date": "12 9 月 2025",
"category": "科技"
},
{
"name": "Building stronger communities worldwide: TIers uphold a long-standing commitment to giving back",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/building-stronger-communities-worldwide-tiers-uphold-a-long-standing-commitment-to-giving-back.html",
"headline": "在全球建立更強大的社區：TI員工長久秉持的回饋承諾",
"subheadline": "從學生輔導計畫到急難救助，TI志工正在改善他們生活與工作的社區",
"image": "/content/dam/ticom/images/people/employees/off-site/employees-volunteering-at-food-pantry.jpg",
"date": "03 9 月 2025",
"category": "TI 的日常生活"
},
{
"name": "Engineering a better world: our communities, workplace and environmental sustainability impact",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/engineering-a-better-world-our-communities-workplace-and-environmental-sustainability-impact.html",
"headline": "打造更美好的世界：我們在社區、職場和環境永續上創造的改變 ",
"subheadline": "從投入教育、降低環境影響，到培育人才與保持業界最佳安全紀錄，我們持續強化企業公民影響力，致力打造更美好的世界。 ",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/solar-farm.jpg",
"date": "10 6 月 2025",
"category": "TI 的日常生活"
},
{
"name": "3 ways semiconductor innovation is powering an evolving energy landscape",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-ways-semiconductor-innovation-is-powering-an-evolving-landscape.html",
"headline": "半導體創新推動能源轉型的三大關鍵方向",
"subheadline": "半導體技術的持續進步，正助力打造再生能源的未來 ",
"image": "/content/dam/ticom/images/people/employees/off-site/keith-ogboenyiya-distributech-keynote.jpg",
"date": "04 6 月 2025",
"category": "科技"
},
{
"name": "共同塑造未來：TI 員工對於打造有影響力職涯的見解",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/shaping-the-future-together-insights-from-tiers-about-building-an-impactful-career.html",
"headline": "共同塑造未來：TI 員工對於打造有影響力職涯的見解",
"subheadline": "處於 TI 旅程不同階段的員工分享有關職涯發展的重要經驗，以及他們如何利用自己的獨特技能和經驗來發揮影響力",
"image": "/content/dam/ticom/images/people/employees/off-site/recruiters-forming-ti-shape-on-grass.jpg",
"date": "16 4 月 2025",
"category": "TI 的日常生活"
},
{
"name": "Looking for the future of autonomous driving? It’s in your car today",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/looking-for-the-future-of-autonomous-driving-its-in-your-car-today.html",
"headline": "正在尋找自駕車的未來？它今日已在您的車中實現",
"subheadline": "現今的半導體如何驅動目前與未來自駕車的發展藍圖",
"image": "/content/dam/ticom/images/applications/sensing/autodriving-car-truck.jpg",
"date": "14 4 月 2025",
"category": "科技"
},
{
"name": "Rewiring STEM education through an engineering mindset",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/rewiring-STEM-education-through-an-engineering-mindset.html",
"headline": "透過工程思維重塑 STEM 教育",
"subheadline": "TI 工程師和領導者運用技術專長、商業知識和實際參與，幫助女性學生為 STEM 領域的職涯做好準備，而獲得了我們公司的傑出志工獎。",
"image": "/content/dam/ticom/images/people/students/employee-volunteering-community-service.jpg",
"date": "07 3 月 2025",
"category": "TI 的日常生活"
},
{
"name": "邁向永續未來，減廢不容忽視",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-importance-of-reducing-waste-in-our-journey-to-create-a-more.html",
"headline": "邁向永續未來，減廢不容忽視",
"subheadline": "隨著半導體需求不斷增長，我們針對營運和製造過程推行的減廢策略性計畫，進一步鞏固了對於守護環境的承諾。",
"image": "/content/dam/ticom/images/people/employees/off-site/delaney-esh-team.jpg",
"date": "07 2 月 2025",
"category": "TI 的日常生活"
},
{
"name": "Software-defined future: Why prioritizing software is essential",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/software-defined-future-why-prioritizing-software-is-essential.html",
"headline": "軟體定義的未來：為何將軟體列為優先至關重要",
"subheadline": "軟體的靈活性、互通性及標準化如何促成未來創新 ",
"image": "/content/dam/ticom/images/themes/business/embedded-ecosystems-software.jpg",
"date": "06 2 月 2025",
"category": "科技"
},
{
"name": "Redefining the commute: The advanced audio technology transforming your drive",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/redefining-the-commute-the-advanced-audio-technology-transforming-your-drive.html",
"headline": "重新定義通勤：先進的音響技術改變您的駕駛體驗",
"subheadline": "從環繞聲到噪音消除，我們公司已爲汽車音響的未來做好準備",
"image": "/content/dam/ticom/images/applications/audio/immersive-auto-cabin-audio.jpg",
"date": "03 1 月 2025",
"category": "科技"
},
{
"name": "Embracing robotics: Innovations that benefit society",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/embracing-robotics-innovations-that-benefit-society.html",
"headline": "擁抱機器人技術：造福社會的創新之舉",
"subheadline": "無論在產業還是個人層面，機器人正在影響我們的日常生活，使之更加美好",
"image": "/content/dam/ticom/images/people/employees/on-site/ti-errol-leon-stands-in-front-of-humanoid.jpg",
"date": "03 1 月 2025",
"category": "科技"
},
{
"name": "Everyday industrial: The unsung technologies enhancing everyday life",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/everyday-industrial--the-unsung-technologies-enhancing-everyday-life.html",
"headline": "工業技術走入日常: 改善生活的隱形技術",
"subheadline": "為何對於實現更永續、便利且安全的生活而言，工業應用不可或缺",
"image": "/content/dam/ticom/images/applications/industrial/everyday-industrial-edge-ai.jpg",
"date": "12 12 月 2024",
"category": "科技"
},
{
"name": "3 ways software-defined vehicles will transform the automotive industry",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-ways-software-defined-vehicles-will-transform-the-automotive-industry.html",
"headline": "軟體定義汽車推動汽車產業轉型的 3 種方式",
"subheadline": "軟體定義氣車輛對製造商、駕駛和乘客有何意義",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-front-of-a-blue-vehicle.jpg",
"date": "03 12 月 2024",
"category": "科技"
},
{
"name": "The road to 100% renewable electricity: Making progress on our sustainability commitments ",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-road-to-100-percent-renewable-electricity-making-progress-on-our-sustainability-commitments.html",
"headline": "100% 再生能源電力之路：朝著實現我們的永續發展承諾持續進步 ",
"subheadline": "我們的環境、安全、健康和永續發展團隊員工介紹了本公司如何擴大再生能源電力的使用，以開創永續發展的未來",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/sustainability-solar-panels.jpg",
"date": "18 11 月 2024",
"category": "TI 的日常生活"
},
{
"name": "Living on the edge: How edge AI enhances everyday experiences",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/living-on-the-edge-how-edge-AI-enhances-everyday-experiences.html",
"headline": "邊緣 AI 如何提升日常體驗",
"subheadline": "邊緣 AI 可讓嵌入式裝置更有效率地使用感測器資料，並改善我們的日常體驗",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/house-with-solar-panels.jpg",
"date": "08 11 月 2024",
"category": "科技"
},
{
"name": "How open-source software is driving the adoption of standards in EV charging",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-open-source-software-is-driving-the-adoption-of-standards-in.html",
"headline": "開放原始碼軟體如何推動業界採用 EV 充電標準",
"subheadline": "開放原始碼軟體對 EV 充電、互通性和 EV 市場的意義為何",
"image": "/content/dam/ticom/images/applications/automotive/ti-automotive-applications.jpg",
"date": "21 10 月 2024",
"category": "科技"
},
{
"name": "Out of this world: How semiconductor technology enables research from space",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/semiconductor-technology-enables-environmental-research-from-space.html",
"headline": "探索世界：半導體技術如何支援太空研究",
"subheadline": "為何成像技術、裝置分類和封裝能協助我們了解我們的星球",
"image": "/content/dam/ticom/images/applications/space/sweep-satellite-over-earth-in-space.jpg",
"date": "03 10 月 2024",
"category": "科技"
},
{
"name": "Equipping the next generation of young female innovators through STEM",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/equipping-the-next-generation-of-young-female-innovators-through-stem.html",
"headline": "透過 STEM 培育新一代年輕女性創新人才",
"subheadline": "TI 和TIer在全球致力投資各類計畫和建立合作夥伴關係，延續創新和發揮影響力的傳統，培養女孩們對 STEM 的信心，幫助他們形塑未來。",
"image": "/content/dam/ticom/images/people/students/students-discussing-in-lab.jpg",
"date": "05 9 月 2024",
"category": "TI 的日常生活"
},
{
"name": "The inception of digital cinema and the journey ahead",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-inception-of-digital-cinema-and-the-journey-ahead.html",
"headline": "數位電影的起源與未來之旅",
"subheadline": "在慶祝DLP Cinema® 技術問世25 週年之際，德州儀器的 DLP 產品創新者齊聚一堂，回顧著數位電影的技術起源與其未來。",
"image": "/content/dam/ticom/images/people/employees/off-site/jeff-marsh-dlp25-behind-the-scenes.jpg",
"date": "24 7 月 2024",
"category": "科技"
},
{
"name": "Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/breaking-the-mold-how-a-new-magnetic-packaging-technology-will-reshape-the-future-of-power-modules.html",
"headline": "突破模封：新型磁性封裝技術如何重塑電源模組的未來",
"subheadline": "全球 TI 員工團隊堅持克服挑戰，為電源模組開發新的 MagPack™ 封裝技術，這一突破將可協助推進電源設計的未來。",
"image": "/content/dam/ticom/images/people/employees/off-site/kenji-kawano-outdoor-running.jpg",
"date": "16 7 月 2024",
"category": "科技"
},
{
"name": "Composing a career from intern to leader",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/composing-a-career-from-intern-to-leader.html",
"headline": "譜出從實習生蛻變成領導者的職涯樂章",
"subheadline": "年輕、熱愛音樂的問題解決者如何發展職涯，從實習生蛻變成TI類比音訊業務的領導者",
"image": "/content/dam/ticom/images/people/employees/on-site/vikas-s-v-holding-guitar-sitting-on-sofa.jpg",
"date": "29 5 月 2024",
"category": "TI 的日常生活"
},
{
"name": "Exploring the essential role of analog technology",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/exploring-the-essential-role-of-analog-technology.html",
"headline": "探索類比技術的重要角色",
"subheadline": "我們的類比訊號鏈事業部負責人闡述通用類比 IC 對電子設計的重要性",
"image": "/content/dam/ticom/images/people/employees/on-site/hagop-kozanian-on-site.jpg",
"date": "30 4 月 2024",
"category": "科技"
},
{
"name": "Seamless connectivity for vehicle networking",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/seamless-connectivity-for-vehicle-networking.html",
"headline": "以無縫連線實現車輛網路",
"subheadline": "區域架構的設計趨勢如何改善汽車通訊",
"image": "/content/dam/ticom/images/applications/automotive/connected-vehicle-zonal-architecture.jpg",
"date": "01 4 月 2024",
"category": "科技"
},
{
"name": "The importance of ensuring supply for foundational semiconductor chips",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-importance-of-ensuring-supply-for-foundational-semiconductor-chips.html",
"headline": "確保基礎半導體晶片供應的重要性",
"subheadline": "為何45奈米至130奈米製程節點格外重要",
"image": "/content/dam/ticom/images/applications/industrial/essential-semiconductor-chips.jpg",
"date": "20 3 月 2024",
"category": "製造"
},
{
"name": "How our employees are living out our legacy of giving back",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-our-employees-are-living-out-our-legacy-of-giving-back.html",
"headline": "TI的員工如何實踐我們回饋社會的傳統",
"subheadline": "從幫助難民安置新家，到消弭學生的教育障礙，我們的員工齊心協力，共同打造更強大的社區。",
"image": "/content/dam/ticom/images/people/employees/off-site/stephan-griebel-with-kid.jpg",
"date": "13 2 月 2024",
"category": "TI 的日常生活"
},
{
"name": "Setting a new standard for electronics in space",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/setting-a-new-standard-for-electronics-in-space.html",
"headline": "為航太電子產品設立新的標準",
"subheadline": "仔細了解我們與 NASA 和產業專家合作，共同開發航太級電子產品的抗輻射塑膠封裝 (稱為 QML P 類)，在考量尺寸、重量和功率下，為航太任務提供前進動力。",
"image": "/content/dam/ticom/images/applications/space/planet-earth-globe-from-space.jpg",
"date": "06 2 月 2024",
"category": "科技"
},
{
"name": "Low-IQ technologies deliver more efficient power management",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/loq-iq-technologies-deliver-more-efficient-power-management.html",
"headline": "低 IQ 技術提供更高效的電源管理",
"subheadline": "隨著對電池供電應用的需求持續快速成長，低 IQ 技術有助於在不影響系統性能的情況下延長電池續航力",
"image": "/content/dam/ticom/images/themes/circuits/low-iq-extended-battery-life.jpg",
"date": "14 12 月 2023",
"category": "科技"
},
{
"name": "The battery-management technology that will strengthen our grid",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-battery-management-technology-that-will-strengthen-our-grid.html",
"headline": "可強化電網的電池管理技術",
"subheadline": "電池系統的半導體創新推動儲能技術應用",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-ess.jpg",
"date": "07 12 月 2023",
"category": "科技"
},
{
"name": "6 semiconductor technologies that help create safer, smarter vehicles",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/6-semiconductor-technologies-that-help-create-safer-smarter-vehicles.html",
"headline": "6 semiconductor technologies that help create safer, smarter vehicles",
"subheadline": "From bumper to bumper and roof to wheels, there is more innovative, efficient semiconductor technology in cars than ever before",
"image": "/content/dam/ticom/images/people/employees/on-site/fern-yoon-standing-on-site.jpg",
"date": "17 11 月 2023",
"category": "科技"
},
{
"name": "Q&A: How TI is creating a sustainable future",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/qa-how-ti-is-creating-a-sustainable-future.html",
"headline": "Q&A: How TI is creating a sustainable future",
"subheadline": "The leader of our Worldwide Environmental, Safety and Health team shares our company’s long history of environmental sustainability and how we’re reducing our environmental impact",
"image": "/content/dam/ticom/images/people/employees/on-site/heidi-means-in-rfab.jpg",
"date": "16 11 月 2023",
"category": ""
},
{
"name": "In the factory and beyond, how robots are enhancing our world",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/in-the-factory-and-beyond-how-robots-are-enhancing-our-world.html",
"headline": "In the factory and beyond, how robots are enhancing our world",
"subheadline": "Once a vision of the future, robots are helping humans become more productive, efficient and safe in almost any setting",
"image": "/content/dam/ticom/images/applications/industrial/robotics-automation.jpg",
"date": "08 11 月 2023",
"category": "科技"
},
{
"name": "Why accurate and reliable high-voltage sensing is critical to the future of electrification",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/why-accurate-and-reliable-high-voltage-sensing-is-critical-to-the-future-of-electrification.html",
"headline": "Why accurate and reliable high-voltage sensing is critical to the future of electrification",
"subheadline": "Technology that measures temperature, current and voltage can help accelerate the transition from fossil fuels to renewable energy sources",
"image": "/content/dam/ticom/images/applications/sensing/high-voltage-sensing-daytime.jpg",
"date": "12 10 月 2023",
"category": "科技"
},
{
"name": "How new connectivity technologies are lowering the barriers to Industry 4.0",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-new-connectivity-technologies-are-lowering-the-barriers-to-industry-4-0.html",
"headline": "How new connectivity technologies are lowering the barriers to Industry 4.0",
"subheadline": "The networking architecture of today’s factories is continuously evolving, unlocking better efficiency, safety and sustainability",
"image": "/content/dam/ticom/images/applications/factory-automation/connected-factory.jpg",
"date": "30 8 月 2023",
"category": "科技"
},
{
"name": "How semiconductor innovations are making edge AI the future",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-semiconductor-innovations-are-making-edge-ai-the-future.html",
"headline": "How semiconductor innovations are making edge AI the future",
"subheadline": "Innovations in processors and software are making edge intelligence simpler and more accessible, and its broad implementation closer",
"image": "/content/dam/ticom/images/themes/edge-ai/edge-ai-am6xa-graphic-platform.jpg",
"date": "29 8 月 2023",
"category": "科技"
},
{
"name": "A remarkable journey from refugee to engineering intern",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/a-remarkable-journey-from-refugee-to-engineering-intern.html",
"headline": "A remarkable journey from refugee to engineering intern",
"subheadline": "His resume is unconventional – shepherd, camel herder, refugee and university student – but Hassan is now on the cusp of a new career as an electrical engineer and hopes to one day share his expertise to make an impact in his community in Chad",
"image": "/content/dam/ticom/images/people/employees/on-site/hassan-eisse-outside-ti-campus.jpg",
"date": "18 8 月 2023",
"category": "TI 的日常生活"
},
{
"name": "Building a more sustainable energy ecosystem",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/building-a-more-sustainable-energy-ecosystem.html",
"headline": "Building a more sustainable energy ecosystem",
"subheadline": "Technology that captures, converts and distributes energy effectively and efficiently will enable the shift from fossil fuels to renewable energy sources and help create a sustainable future",
"image": "/content/dam/ticom/images/applications/industrial/solar-panel-over-cityscape-nightlight.jpg",
"date": "15 8 月 2023",
"category": "科技"
},
{
"name": "Driving change for gender equality in STEM",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/driving-change-for-gender-equality-in-stem.html",
"headline": "Driving change for gender equality in STEM",
"subheadline": "Fern Yoon, a leader in automotive systems, is passionate about paving the road ahead for women engineers and the future of vehicle electrification",
"image": "/content/dam/ticom/images/people/employees/on-site/fern-yoon-standing.jpg",
"date": "20 6 月 2023",
"category": "TI 的日常生活"
},
{
"name": "The symphony of precision: Harmonizing power and signal integrity with low-noise technology",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-symphony-of-precision-harmonizing-power-and-signal-integrity-with-low-noise-technology.html",
"headline": "The symphony of precision: Harmonizing power and signal integrity with low-noise technology",
"subheadline": "Innovations in low-noise and precision technologies are contributing to the vast performance improvements of sensitive medical, test and measurement, and electric vehicle battery-management systems",
"image": "/content/dam/ticom/images/people/employees/on-site/steven-schnier-talking-to-colleagues.jpg",
"date": "13 6 月 2023",
"category": "科技"
},
{
"name": "How TI’s investments in back-end manufacturing are helping build capacity for decades to come",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-tis-investments-in-back-end-manufacturing-are-helping-build-capacity-for-decades-to-come.html",
"headline": "TI 對後端製造業務的投資如何協助建立未來數十年的產能",
"subheadline": "我們正在馬拉西亞的吉隆坡和麻六甲兩地不斷擴展組裝與測試業務，這是 TI 長期策略的一部分，有助提供更有力的供應保證，同時滿足客戶需求",
"image": "/content/dam/ticom/images/themes/facilities/chengdu-at-10-flip.jpg",
"date": "13 6 月 2023",
"category": "製造"
},
{
"name": "Q&A: TI is inspiring a global culture of building stronger communities",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/qa-ti-is-inspiring-a-global-culture-of-building-stronger-communities.html",
"headline": "Q&A: TI is inspiring a global culture of building stronger communities",
"subheadline": "Andy Smith, leader of our Giving and Volunteering team and executive director of the TI Foundation, discusses how the philanthropic spirit is ingrained in TI’s culture, how we’re strengthening communities where we live and work, and what giving back means to him personally",
"image": "/content/dam/ticom/images/people/students/reading-day22.jpg",
"date": "23 5 月 2023",
"category": "TI 的日常生活"
},
{
"name": "How semiconductors enable the future of energy",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-semiconductors-enable-the-future-of-energy.html",
"headline": "How semiconductors enable the future of energy",
"subheadline": "Analog and embedded processing products are enabling electrification through smarter, reliable and more accessible solar, energy storage and electric-vehicle charging systems",
"image": "/content/dam/ticom/images/people/employees/off-site/renewable-energy.jpg",
"date": "18 4 月 2023",
"category": "科技"
},
{
"name": "How one engineer’s problem-solving mindset is helping serve the unsheltered and hungry",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-one-engineers-problem-solving-mindset-is-helping-serve-the-unsheltered-and-hungry.html",
"headline": "How one engineer’s problem-solving mindset is helping serve the unsheltered and hungry",
"subheadline": "An engineer from our wafer fab in Lehi, Utah, earned our Community Impact Award for demonstrating our company values and working toward broader, sustainable solutions for those without homes",
"image": "/content/dam/ticom/images/people/employees/off-site/nathan-reed-in-salt-lake-city.jpg",
"date": "17 4 月 2023",
"category": "TI 的日常生活"
},
{
"name": "3 trends impacting the future of embedded processing technology",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-trends-impacting-the-future-of-embedded-processing-technology.html",
"headline": "影響嵌入式處理技術未來的 3 個趨勢",
"subheadline": "嵌入式處理技術的未來會是什麼樣貌？",
"image": "/content/dam/ticom/images/applications/industrial/gp-platform-process-warehouse.jpg",
"date": "07 4 月 2023",
"category": "科技"
},
{
"name": "3 reasons GaN is changing power management",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-reason-gan-is-changing-power-management.html",
"headline": "3 reasons GaN is changing power management",
"subheadline": "Gallium nitride is replacing silicon in a growing list of applications that require greater power density and energy efficiency",
"image": "/content/dam/ticom/images/applications/enterprise-system/hv-foundation-delta-server.jpg",
"date": "04 4 月 2023",
"category": "科技"
},
{
"name": "High-voltage technologies are key to empowering a more sustainable future",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/high-voltage-technologies-are-key-to-empowering-a-more-sustainable-future.html",
"headline": "高電壓技術是使未來走向更永續的關鍵",
"subheadline": "隨著電氣化越來越普遍，半導體創新有助於安全可靠地使用電動車、再生能源和其它高電壓系統",
"image": "/content/dam/ticom/images/applications/automotive/ev-charging-hvfoundation.jpg",
"date": "23 3 月 2023",
"category": "科技"
},
{
"name": "How vehicle networks help keep drivers safe",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-vehicle-networks-help-keep-drivers-safe.html",
"headline": "How vehicle networks help keep drivers safe",
"subheadline": "Take vehicle safety to the next level with integrated and connected communications protocols",
"image": "/content/dam/ticom/images/applications/automotive/adas-vehicle-networks.jpg",
"date": "23 3 月 2023",
"category": "科技"
},
{
"name": "Q&A: Pradeep Shenoy shares how he’s inspiring the next generation of power engineers",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/qa-pradeep-shenoy-shares-how-hes-inspiring-the-next-generation-of-power-engineers.html",
"headline": "Q&A: Pradeep Shenoy 分享啟發下一代電力工程師的心得",
"subheadline": "Pradeep Shenoy 希望持續推廣電力應用：更多電動車...",
"image": "/content/dam/ticom/images/people/employees/on-site/pradeep-shenoy-sahana-krishnan-lab.jpg",
"date": "14 3 月 2023",
"category": "TI 的日常生活"
},
{
"name": "Ultrasonic lens cleaning brings camera reliability into focus",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/ultrasonic-lens-cleaning-brings-camera-reliability-into-focus.html",
"headline": "超音波鏡頭清潔技術使攝影機可靠性成為焦點",
"subheadline": "當技術帶來更高的自主性時，車輛、無人機、機器人等機械的攝影機和感測器數量成倍數增長，純電力驅動方式有助於保持清潔",
"image": "/content/dam/ticom/images/applications/automotive/ultra-lens-cleaning-side-mirror-auto.jpg",
"date": "22 2 月 2023",
"category": "科技"
},
{
"name": "Haviv Ilan to become next president and CEO of TI",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/haviv-ilan-to-become-next-president-and-ceo-of-ti.html",
"headline": "Haviv Ilan 將成為德州儀器的下一任總裁兼執行長",
"subheadline": "現任執行長 Rich Templeton 將繼續擔任董事長",
"image": "/content/dam/ticom/images/people/employees/on-site/ceo-haviv-ilan.jpg",
"date": "03 2 月 2023",
"category": "TI 的日常生活"
},
{
"name": "5 reasons EVs are here to stay",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/5-reasons-evs-are-here-to-stay.html",
"headline": "電動車成為趨勢的 5 個原因",
"subheadline": "半導體技術是電動車創新曲線中的重要推手，不僅排除各種電動車採用的阻礙，也讓汽車製造商能夠設計受到消費者喜愛的平價車款",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-car.jpg",
"date": "04 1 月 2023",
"category": "科技"
},
{
"name": "TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/tis-latest-300-millimeter-wafer-fab-in-lehi-utah-begins-production.html",
"headline": "TI 於猶他州 Lehi 的最新 12 吋晶圓廠已開始投入量產",
"subheadline": "LFAB 在我們公司購入設施後一年後開始投入量產，也是我們在 2022 年開始量產的第二家 12 吋晶圓廠",
"image": "/content/dam/ticom/images/themes/facilities/lfab-front-entrance-aerial-view.jpg",
"date": "19 12 月 2022",
"category": "製造"
},
{
"name": "It’s a Matter of standardization: new wireless protocol provides a connected foundation for smart devices",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/its-a-matter-of-standardization-new-wireless-protocol-provides-a-connected-foundation-for-smart-devices.html",
"headline": "Matter 標準將成為重點：全新無線協定可為智慧產品提供連線基礎",
"subheadline": "隨著智慧連線產品越來越融入日常生活中，Matter 無線連線協定旨在將分裂的物聯網生態系加以整合",
"image": "/content/dam/ticom/images/applications/communication-equipment/matter-protocol.jpg",
"date": "09 12 月 2022",
"category": "科技"
},
{
"name": "Q&A: How TI is investing in manufacturing capacity to support growth for decades to come",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/qa-how-ti-is-investing-in-manufacturing-capacity-to-support-growth-for-decades-to-come.html",
"headline": "Q&A：TI 如何透過提高製造產能的投資，以支援未來數十載的需求成長",
"subheadline": "TI技術與製造事業群資深副總裁 Kyle Flessner，分享 TI 擴大自有產能的長期計畫",
"image": "/content/dam/ticom/images/people/employees/on-site/flessner-kyle-manufacturing.jpg",
"date": "11 11 月 2022",
"category": "製造"
},
{
"name": "How thermal efficiency is helping data centers run more sustainably",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-thermal-efficiency-is-helping-data-centers-run-more-sustainably.html",
"headline": "熱效率如何幫助資料中心加強永續運作",
"subheadline": "隨著伺服器電源需求增加，創新的半導體設計和封裝技術正在改善資料中心的效率",
"image": "/content/dam/ticom/images/applications/enterprise-system/thermals-power-density.jpg",
"date": "10 11 月 2022",
"category": "科技"
},
{
"name": "5 things you should know about V2G",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/5-things-you-should-know-about-v2g.html",
"headline": "您應了解的 V2G 五大重點",
"subheadline": "不斷成長的需求正將電網推向極限，車輛至電網 (V2G) 雙向充電可幫助弭平峰值容量",
"image": "/content/dam/ticom/images/applications/automotive/vehicle-to-grid.jpg",
"date": "10 11 月 2022",
"category": "科技"
},
{
"name": "Traction inverters: the intersection of automotive innovation and performance",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/traction-inverters-the-intersection-of-automotive-innovation-and-performance.html",
"headline": "牽引逆變器：汽車創新與性能的交集",
"subheadline": "新一代牽引逆變器的半導體創新有助於進一步提升電動車性能，讓駕駛者能充分享受駕馭快感",
"image": "/content/dam/ticom/images/applications/automotive/red-auto-mountain-road-traction-inverter.jpg",
"date": "27 10 月 2022",
"category": "科技"
},
{
"name": "Dan Wang on enabling a safer world with TI mmWave radar: ‘It’s just the beginning’",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/dan-wang-on-enabling-a-safer-world-with-ti-mmwave-radar-its-just-the-beginning.html",
"headline": "Dan Wang 談如何運用 TI mmWave 雷達讓現實世界更加安全：「這只是開端」",
"subheadline": "Dan 是毫米波雷達應用的先驅，擁有對感測技術未來的願景。",
"image": "/content/dam/ticom/images/people/employees/on-site/dan-wang.jpg",
"date": "01 10 月 2022",
"category": "科技"
},
{
"name": "TI’s new 300-millimeter wafer fab in Richardson, Texas, begins initial production",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/tis-new-300-millimeter-wafer-fab-in-richardson-texas-begins-initial-production.html",
"headline": "TI 位於德州Richardson的最新12吋晶圓廠開始投入首批量產",
"subheadline": "我們正在打造半導體製造業的新紀元，以支援電子領域未來的成長需求",
"image": "/content/dam/ticom/images/themes/facilities/richardson-texas-wafer-fabs.jpg",
"date": "29 9 月 2022",
"category": "製造"
},
{
"name": "The vehicle-to-grid vision: unleashing the power of electric vehicles",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-vehicle-to-grid-vision-unleashing-the-power-of-electric-vehicles.html",
"headline": "車輛到電網願景：發揮電動車的強大威力",
"subheadline": "有了半導體技術的支援，車輛到電網 (V2G) 雙向充電可以提供電池電力，在尖峰需量期間強化電網，並在電價昂貴或電力中斷時期，為您的住家供電",
"image": "/content/dam/ticom/images/applications/automotive/vehicle-grid-technology.jpg",
"date": "23 8 月 2022",
"category": "科技"
},
{
"name": "3 ways semiconductors enhance automation and efficiency",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/3-ways-semiconductors-enhance-automation-and-efficiency.html",
"headline": "半導體提高自動化和效率的 3 種趨勢",
"subheadline": "半導體技術正在協助盡可能提升一系列從機器人技術到工廠自動化、電網、家庭自動化等工業系統的生產力",
"image": "/content/dam/ticom/images/applications/industrial/enhancing-automation-warehouse.jpg",
"date": "10 8 月 2022",
"category": "科技"
},
{
"name": "From sun to switch, semiconductors enable the journey of energy",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/from-sun-to-switch-semiconductors-enable-the-journey-of-energy.html",
"headline": "從太陽到開關，半導體開啟了能源之旅",
"subheadline": "隨著再生能源的普及，半導體讓高效率且安全的能源運輸在更多家庭、建築物和城市中實現",
"image": "/content/dam/ticom/images/applications/industrial/residential-solar-panels.jpg",
"date": "02 8 月 2022",
"category": "科技"
},
{
"name": "Space-grade ICs help the James Webb Telescope peer deep into the cosmos",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/space-grade-ics-help-the-james-webb-telescope-peer-deep-into-the-cosmos.html",
"headline": "太空級 IC 協助韋伯太空望遠鏡深入宇宙",
"subheadline": "隨著韋伯太空望遠鏡以前所未有的解析度和靈敏度觀察宇宙，美國太空總署發佈迄今最大型和最強大的太空望遠鏡所拍攝的第一批影像",
"image": "/content/dam/ticom/images/applications/space/webb-telescope.jpg",
"date": "01 8 月 2022",
"category": "科技"
},
{
"name": "How sensor fusion is driving vehicle autonomy forward",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-sensor-fusion-is-driving-vehicle-autonomy-forward.html",
"headline": "感測器融合是如何促進汽車自主功能發展",
"subheadline": "隨著 ADAS 技術擴展到對時間較敏感的關鍵應用，例如緊急剎車、警告和避免汽車正面碰撞，以及盲點偵測，結合來自多個感測器的資料有助於做出可靠、即時的決定，因此實現更安全的自動駕駛",
"image": "/content/dam/ticom/images/applications/automotive/real-time-processing.jpg",
"date": "30 6 月 2022",
"category": "科技"
},
{
"name": "The power of packaging",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-power-of-packaging.html",
"headline": "封裝的力量",
"subheadline": "隨著電子產品的外型日益輕巧、整入越來越多元件，包覆和保護積體電路的封裝益形關鍵",
"image": "/content/dam/ticom/images/themes/size/small-packaging.jpg",
"date": "09 6 月 2022",
"category": "科技"
},
{
"name": "Cobots bring the future to the factory",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/cobots-bring-the-future-to-the-factory.html",
"headline": "協作機器人為工廠導入未來",
"subheadline": "飛天車和家事機器人將在廿一世紀問世的夢想，至今尚未成真。但拜半導體科技進展之賜，各地的工廠廠區正逐漸為我們勾勒出未來願景。",
"image": "/content/dam/ticom/images/applications/industrial/factory-automation-sensor-mmwave-radar.jpg",
"date": "09 6 月 2022",
"category": "科技"
},
{
"name": "Small satellites, big advances",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/small-satellites-big-advances.html",
"headline": "小衛星 大進展",
"subheadline": "德州儀器 (TI) 提供可靠度極高的太空級電源管理元件，為智慧功能更強、體積更小的次世代衛星協助供電，讓美國航太總署 (NASA) 工程師得以更深入了解宇宙",
"image": "/content/dam/ticom/images/applications/space/earth-with-illustrated-air-routes-network.jpg",
"date": "28 4 月 2022",
"category": "科技"
},
{
"name": "Tackling the EMI challenge",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/tackling-the-emi-challenge.html",
"headline": "應對 EMI 挑戰",
"subheadline": "隨著消費者期望電子產品達到更好的性能，減輕電磁干擾 (EMI) 成為待解決的重要問題",
"image": "/content/dam/ticom/images/people/employees/on-site/jeff-meroni-engineering-progress.jpg",
"date": "28 4 月 2022",
"category": "科技"
},
{
"name": "From idea to invention: The origin story of the tiny chip that changed the world",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/from-idea-to-invention-the-origin-story-of-the-tiny-chip-that-changed-the-world.html",
"headline": "改變世界的晶片",
"subheadline": "TI 人 Jack Kilby 發明積體電路，以及其後數十年間持續不斷的創新，體現了德州儀器運用半導體降低電子產品成本，開創更美好世界的承諾。",
"image": "/content/dam/ticom/images/people/employees/on-site/kilby-integrated-circuit-historical.jpg",
"date": "28 4 月 2022",
"category": "科技"
},
{
"name": "Building a fast, flexible EV charging network",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/building-a-fast-flexible-EV-charging-network.html",
"headline": "德州儀器協助打造快速又靈活的電動車充電網路",
"subheadline": "半導體技術將為電網業者提供更高靈活性，在未來電動車願景中幫助最佳化能源基礎設施",
"image": "/content/dam/ticom/images/people/employees/off-site/henrik-mannesson-electric-car.jpg",
"date": "29 3 月 2022",
"category": "科技"
},
{
"name": "Meet the risk-buster: How functional safety helps keep you safe",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/meet-the-risk-buster-how-functional-safety-helps-keep-you-safe.html",
"headline": "認識風險屏障：功能性安全如何有助於確保您的安全",
"subheadline": "無論是預防系統故障或預測、減輕未來風險，功能性安全已改變工程師對系統設計的思考模式",
"image": "/content/dam/ticom/images/applications/automotive/functional-safety-dashboard-display.jpg",
"date": "29 3 月 2022",
"category": "科技"
},
{
"name": "Q&A: The technology making real-time processing easy and affordable",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/qa-the-technology-making-real-time-processing-easy-and-affordable.html",
"headline": "讓即時處理更輕鬆、價格更實惠的關鍵技術 MCU",
"subheadline": "越來越多電子系統需要在邊緣執行即時控制、智慧分析與通訊等各項應用，而高效能 MCU 以設計簡便、具成本效益的優點，成為業界首選解決方案。",
"image": "/content/dam/ticom/images/people/employees/on-site/mike-pienovi-in-lab.jpg",
"date": "15 3 月 2022",
"category": "科技"
},
{
"name": "What’s next in BMS? Safer, more affordable electric vehicles",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/whats-next-in-bms-safer-more-affordable-electric-vehicles.html",
"headline": "BMS 的未來願景是什麼？更安全、更平價的電動車",
"subheadline": "在汽車製造商考量新的電動車電池化學物質之際，搭載先進半導體技術的電池管理系統 (BMS) 也變得比以往更為重要",
"image": "/content/dam/ticom/images/applications/automotive/red-car-wheat-field.jpg",
"date": "25 1 月 2022",
"category": "科技"
},
{
"name": "ADAS: The technology driving automotive safety forward",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/adas-the-technology-driving-automotive-safety-forward.html",
"headline": "先進駕駛輔助系統推動車輛安全穩步前行",
"subheadline": "ADAS 使車輛更安全、更智慧，幫助汽車業者實現「零碰撞」的未來願景",
"image": "/content/dam/ticom/images/applications/automotive/cars-using-adas-on-highway.jpg",
"date": "05 10 月 2021",
"category": "科技"
},
{
"name": "Carmakers charge ahead with electric vehicle powertrain integration",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/carmakers-charge-ahead-with-electric-vehicle-powertrain-integration.html",
"headline": "德州儀器實現動力傳動系統整合，幫助電動車性能大躍進",
"subheadline": "將動力傳動系統整合至精巧的機械箱體內，打造更平價、高性能的電動車（EV）",
"image": "/content/dam/ticom/images/applications/automotive/integrated-power-train.jpg",
"date": "14 5 月 2021",
"category": "科技"
},
{
"name": "Vision: Possible",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/vision-possible.html",
"headline": "視覺功能 並非不可能的任務",
"subheadline": "全球首創毫米波雷達系統單晶片的背後故事：第一篇",
"image": "/content/dam/ticom/images/applications/sensing/firefighter-helmet-sensing.jpg",
"date": "29 9 月 2020",
"category": "科技"
},
{
"name": "The new tech frontier in senior care",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/the-new-tech-frontier-in-senior-care.html",
"headline": "年長者照護的技術新境界",
"subheadline": "感測器、穿戴式監控器和數據等符合成本效益、簡單易用的技術正在為老年人口照護創造新的可能性。",
"image": "/content/dam/ticom/images/applications/sensing/telehealth-vital-sign-detection-sensor-mmwave-radar.jpg",
"date": "11 8 月 2020",
"category": "科技"
},
{
"name": "Perfect timing",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/perfect-timing.html",
"headline": "Perfect timing",
"subheadline": "深入了解可幫助地球最大電波望遠鏡 (平方公里陣列) 同步的微晶片",
"image": "/content/dam/ticom/images/applications/space/square-kilometer-array.jpg",
"date": "21 7 月 2020",
"category": "科技"
},
{
"name": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others",
"path": "https://www.ti.com/zh-tw/about-ti/behind-chip/articles/how-two-engineers-used-problem-solving-to-turn-a-terminal-diagnosis-into-hope-for-their-son-and-countless-others.html",
"headline": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others",
"subheadline": "Everything changed for TI engineers Matt and Gina Hann on March 7, when they were told to prepare for the end of their son’s life.",
"image": "/content/dam/ticom/images/people/employees/off-site/batten-hope-family.jpg",
"date": "19 9 月 2017",
"category": "科技"
}
]