SBAS511E july   2010  – july 2023 ADS1013-Q1 , ADS1014-Q1 , ADS1015-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6.   Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: I2C
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer
      2. 7.3.2 Analog Inputs
      3. 7.3.3 Full-Scale Range (FSR) and LSB Size
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Oscillator
      6. 7.3.6 Output Data Rate and Conversion Time
      7. 7.3.7 Digital Comparator (ADS1014-Q1 and ADS1015-Q1 Only)
      8. 7.3.8 Conversion Ready Pin (ADS1014-Q1 and ADS1015-Q1 Only)
      9. 7.3.9 SMbus Alert Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset and Power-Up
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Single-Shot Mode
        2. 7.4.2.2 Continuous-Conversion Mode
      3. 7.4.3 Duty Cycling For Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 I2C Address Selection
        2. 7.5.1.2 I2C General Call
        3. 7.5.1.3 I2C Speed Modes
      2. 7.5.2 Target Mode Operations
        1. 7.5.2.1 Receive Mode
        2. 7.5.2.2 Transmit Mode
      3. 7.5.3 Writing To and Reading From the Registers
      4. 7.5.4 Data Format
    6. 7.6 Register Map
      1. 7.6.1 Address Pointer Register (address = N/A) [reset = N/A]
      2. 7.6.2 Conversion Register (P[1:0] = 00b) [reset = 0000h]
      3. 7.6.3 Config Register (P[1:0] = 01b) [reset = 8583h]
      4. 7.6.4 Lo_thresh (P[1:0] = 10b) [reset = 8000h] and Hi_thresh (P[1:0] = 11b) [reset = 7FFFh] Registers
  10. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 Single-Ended Inputs
      3. 8.1.3 Input Protection
      4. 8.1.4 Unused Inputs and Outputs
      5. 8.1.5 Analog Input Filtering
      6. 8.1.6 Connecting Multiple Devices
      7. 8.1.7 Quick-Start Guide
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Considerations
        2. 8.2.2.2 Operational Amplifier Considerations
        3. 8.2.2.3 ADC Input Common-Mode Considerations
        4. 8.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 8.2.2.5 Noise and Input Impedance Considerations
        6. 8.2.2.6 First-Order RC Filter Considerations
        7. 8.2.2.7 Circuit Implementation
        8. 8.2.2.8 Results Summary
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Sequencing
      2. 8.3.2 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

at VDD = 3.3 V, data rate = 128 SPS, and full-scale input-voltage range (FSR) = ±2.048 V (unless otherwise noted); maximum and minimum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUT
Common-mode input impedance FSR = ±6.144 V(1) 10
FSR = ±4.096 V(1), FSR = ±2.048 V 6
FSR = ±1.024 V 3
FSR = ±0.512 V, FSR = ±0.256 V 100
Differential input impedance FSR = ±6.144 V(1) 22
FSR = ±4.096 V(1) 15
FSR = ±2.048 V 4.9
FSR = ±1.024 V 2.4
FSR = ±0.512 V, ±0.256 V 710
SYSTEM PERFORMANCE
Resolution (no missing codes) 12 Bits
DR Data rate 128, 250, 490, 920, 1600, 2400, 3300 SPS
Data rate variation All data rates –10% 10%
INL Integral nonlinearity DR = 128 SPS, FSR = ±2.048 V(2) 0.5 LSB
Offset error FSR = ±2.048 V, differential inputs -0.5 0 0.5 LSB
FSR = ±2.048 V, single-ended inputs ±0.25
Offset drift over temperature FSR = ±2.048 V 0.005 LSB/°C
Long-term offset drift FSR = ±2.048 V, TA = 125°C, 1000 hrs ±1 LSB
Offset channel match Match between any two inputs 0.25 LSB
Gain error(3) FSR = ±2.048 V, TA = 25°C 0.05% 0.25%
Gain drift over temperature(3) FSR = ±0.256 V 7 ppm/°C
FSR = ±2.048 V 5 40
FSR = ±6.144 V(1) 5
Long-term gain drift FSR = ±2.048 V, TA = 125°C, 1000 hrs ±0.05 %
Gain match(3) Match between any two gains 0.02% 0.1%
Gain channel match Match between any two inputs 0.05% 0.1%
DIGITAL INPUT/OUTPUT
VIH High-level input voltage 0.7 VDD 5.5 V
VIL Low-level input voltage GND 0.3 VDD V
VOL Low-level output voltage IOL = 3 mA GND 0.15 0.4 V
Input leakage current GND < VDIG < VDD –10 10 μA
POWER-SUPPLY
IVDD Supply current Power-down TA = 25°C 0.5 2 μA
5
Operating TA = 25°C 150 200
300
PD Power dissipation VDD = 5.0 V 0.9 mW
VDD = 3.3 V 0.5
VDD = 2.0 V 0.3
This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V must be applied to the analog inputs of the device. See Table 7-1 for more information.
Best-fit INL; covers 99% of full-scale.
Includes all errors from onboard PGA and voltage reference.