SBAS350G June   2005  – January 2021 ADS1232 , ADS1234

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs (AINPX, AINNX)
      2. 8.3.2  Temperature Sensor (ADS1232 Only)
      3. 8.3.3  Low-Noise PGA
        1. 8.3.3.1 PGA Bypass Capacitor
      4. 8.3.4  Voltage Reference Inputs (REFP, REFN)
      5. 8.3.5  Clock Sources
      6. 8.3.6  Digital Filter Frequency Response
      7. 8.3.7  Settling Time
      8. 8.3.8  Data Rate
      9. 8.3.9  Data Format
      10. 8.3.10 Data Ready and Data Output (DRDY/DOUT)
      11. 8.3.11 Serial Clock Input (SCLK)
      12. 8.3.12 Data Retrieval
    4. 8.4 Device Functional Modes
      1. 8.4.1 Offset Calibration Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Standby Mode With Offset-Calibration
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Power-Up Sequence
      6. 8.4.6 Summary of Serial Interface Waveforms
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.2 Temperature Sensor (ADS1232 Only)

On-chip diodes provide temperature-sensing capability. By setting the TEMP pin high, the selected analog inputs are disconnected and the inputs to the ADC are connected to the anodes of two diodes scaled to 1x and 80x in current and size, as shown in Figure 8-1. By measuring the difference in voltage of these diodes, temperature changes can be inferred from a baseline temperature. Typically, the difference in diode voltage is 111.7 mV at 25°C with a temperature coefficient of 379 µV/°C. With PGA gain = 1 and 2, the difference voltage output from the PGA is 111.7 mV and 223.4 mV, respectively. The temperature sensor function is impossible to use with PGA gain = 64 and 128.

GUID-BBB835A1-9603-42CD-9491-97EBB256D69D-low.gifFigure 8-1 Measurement of the Temperature Sensor in the Input Multiplexer