SBAS446H December   2009  – February 2016 ADS1282-HT

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information
    4. 7.4  Electrical Characteristics
    5. 7.5  Electrical Characteristics (PW Package)
    6. 7.6  Timing Requirements
    7. 7.7  Pulse-Sync Timing Requirements
    8. 7.8  Reset Timing Requirements
    9. 7.9  Switching Characteristics
    10. 7.10 Modulator Switching Characteristics
    11. 7.11 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Noise Performance
      2. 8.3.2  Input-Referred Noise
      3. 8.3.3  Idle Tones
      4. 8.3.4  Operating Mode
      5. 8.3.5  Analog Inputs and Multiplexer
      6. 8.3.6  PGA (Programmable Gain Amplifier)
      7. 8.3.7  ADC
      8. 8.3.8  Modulator
      9. 8.3.9  Modulator Over-Range
      10. 8.3.10 Modulator Input Impedance
      11. 8.3.11 Modulator Over-Range Detection (MFLAG)
      12. 8.3.12 Voltage Reference Inputs (VREFP, VREFN)
      13. 8.3.13 Digital Filter
        1. 8.3.13.1 Sinc Filter Stage (Sinx/X)
        2. 8.3.13.2 FIR Stage
        3. 8.3.13.3 Group Delay and Step Response
          1. 8.3.13.3.1 Linear Phase Response
          2. 8.3.13.3.2 Minimum Phase Response
        4. 8.3.13.4 HPF Stage
      14. 8.3.14 Master Clock Input (CLK)
      15. 8.3.15 Synchronization (SYNC Pin and Sync Command)
      16. 8.3.16 Pulse-Sync Mode
      17. 8.3.17 Continuous-Sync Mode
      18. 8.3.18 Reset (RESET Pin and Reset Command)
      19. 8.3.19 Power-Down (PWDN Pin and Standby Command)
      20. 8.3.20 Power-On Sequence
      21. 8.3.21 Serial Interface
        1. 8.3.21.1 Serial Clock (SCLK)
        2. 8.3.21.2 Data Input (DIN)
        3. 8.3.21.3 Data Output (DOUT)
        4. 8.3.21.4 Data Ready (DRDY)
      22. 8.3.22 Data Format
      23. 8.3.23 Reading Data
        1. 8.3.23.1 Read Data Continuous
        2. 8.3.23.2 Read Data by Command
      24. 8.3.24 One-Shot Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modulator Output Mode
    5. 8.5 Programming
      1. 8.5.1 Commands
        1. 8.5.1.1  WAKEUP: Wake-Up from Standby Mode
        2. 8.5.1.2  STANDBY: Standby Mode
        3. 8.5.1.3  SYNC: Synchronize the A/D Conversion
        4. 8.5.1.4  RESET: Reset the Device
        5. 8.5.1.5  RDATAC: Read Data Continuous
        6. 8.5.1.6  SDATAC: Stop Read Data Continuous
        7. 8.5.1.7  RDATA: Read Data By Command
        8. 8.5.1.8  RREG: Read Register Data
        9. 8.5.1.9  WREG: Write to Register
        10. 8.5.1.10 OFSCAL: Offset Calibration
        11. 8.5.1.11 GANCAL: Gain Calibration
      2. 8.5.2 Calibration Commands
        1. 8.5.2.1 OFSCAL Command
        2. 8.5.2.2 GANCAL Command
      3. 8.5.3 User Calibration
      4. 8.5.4 Configuration Guide
    6. 8.6 Register Maps
      1. 8.6.1 ADS1282-HT Register Map Information
      2. 8.6.2 ID Register
      3. 8.6.3 Configuration Registers
        1. 8.6.3.1 Configuration Register 0
        2. 8.6.3.2 Configuration Register 1
      4. 8.6.4 HPF1 and HPF0
        1. 8.6.4.1 High-Pass Filter Corner Frequency, Low Byte
        2. 8.6.4.2 High-Pass Filter Corner Frequency, High Byte
      5. 8.6.5 OFC2, OFC1, OFC0
        1. 8.6.5.1 Offset Calibration, Low Byte
        2. 8.6.5.2 Offset Calibration, Mid Byte
        3. 8.6.5.3 Offset Calibration, High Byte
      6. 8.6.6 FSC2, FSC1, FSC0
        1. 8.6.6.1 Full-Scale Calibration, Low Byte
        2. 8.6.6.2 Full-Scale Calibration, Mid Byte
        3. 8.6.6.3 Full-Scale Calibration, High Byte
      7. 8.6.7 Offset and Full-Scale Calibration Registers
        1. 8.6.7.1 OFC[2:0] Registers
        2. 8.6.7.2 FSC[2:0] Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Geophone Interface Typical Application
        1. 9.2.1.1 Detailed Design Procedure
      2. 9.2.2 Digital Connection to a Field Programmable Gate Array (FPGA) Device Typical Application
        1. 9.2.2.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 HPF Transfer Function
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.