SBASAF7C january   2022  – may 2023 AFE7906

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Description (continued)
  6. 5Revision History
  7. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  RF ADC Electrical Characteristics
    6. 6.6  PLL/VCO/Clock Electrical Characteristics
    7. 6.7  Digital Electrical Characteristics
    8. 6.8  Power Supply Electrical Characteristics
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
      1. 6.11.1 RX Typical Characteristics 30 MHz and 400 MHz
      2. 6.11.2 RX Typical Characteristics at 800MHz
      3. 6.11.3 RX Typical Characteristics 1.75GHz to 1.9GHz
      4. 6.11.4 RX Typical Characteristics 2.6GHz
      5. 6.11.5 RX Typical Characteristics 3.5GHz
      6. 6.11.6 RX Typical Characteristics 4.9GHz
      7. 6.11.7 RX Typical Characteristics 6.8GHz
      8. 6.11.8 PLL and Clock Typical Characteristics
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) AFE7906 UNIT
FC-BGA
400 PINS
RθJA Junction-to-ambient thermal resistance 16.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.42 °C/W
RθJB Junction-to-board thermal resistance 4.85 °C/W
ΨJT Junction-to-top characterization parameter 0.12 °C/W
ΨJB Junction-to-board characterization parameter 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.