SPRSP65G April   2021  – May 2024 AM2431 , AM2432 , AM2434

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM243x ALV Pin Diagram
      2. 5.1.2 AM243x ALX Pin Diagram
    2. 5.2 Pin Attributes
      1.      13
      2.      14
      3. 5.2.1 AM243x Package Comparison Table (ALV vs. ALX)
    3. 5.3 Signal Descriptions
      1.      17
      2. 5.3.1  AM243x_ALX Package - Unsupported Interfaces and Signals
      3. 5.3.2  ADC
        1.       MAIN Domain Instances
          1.        21
      4. 5.3.3  CPSW
        1.       MAIN Domain Instances
          1.        24
          2.        25
          3.        26
          4.        27
          5. 5.3.3.1.1 CPSW3G IOSETs
      5. 5.3.4  CPTS
        1.       MAIN Domain Instances
          1.        31
          2.        32
      6. 5.3.5  DDRSS
        1.       MAIN Domain Instances
          1.        35
      7. 5.3.6  ECAP
        1.       MAIN Domain Instances
          1.        38
          2.        39
          3.        40
      8. 5.3.7  Emulation and Debug
        1.       MAIN Domain Instances
          1.        43
        2.       MCU Domain Instances
          1.        45
      9. 5.3.8  EPWM
        1.       MAIN Domain Instances
          1.        48
          2.        49
          3.        50
          4.        51
          5.        52
          6.        53
          7.        54
          8.        55
          9.        56
          10.        57
      10. 5.3.9  EQEP
        1.       MAIN Domain Instances
          1.        60
          2.        61
          3.        62
      11. 5.3.10 FSI
        1.       MAIN Domain Instances
          1.        65
          2.        66
          3.        67
          4.        68
          5.        69
          6.        70
          7.        71
          8.        72
      12. 5.3.11 GPIO
        1.       MAIN Domain Instances
          1.        75
          2.        76
        2.       MCU Domain Instances
          1.        78
      13. 5.3.12 GPMC
        1.       MAIN Domain Instances
          1.        81
          2. 5.3.12.1.1 GPMC0 IOSETs (ALV)
      14. 5.3.13 I2C
        1.       MAIN Domain Instances
          1.        85
          2.        86
          3.        87
          4.        88
        2.       MCU Domain Instances
          1.        90
          2.        91
      15. 5.3.14 MCAN
        1.       MAIN Domain Instances
          1.        94
          2.        95
      16. 5.3.15 SPI (MCSPI)
        1.       MAIN Domain Instances
          1.        98
          2.        99
          3.        100
          4.        101
          5.        102
        2.       MCU Domain Instances
          1.        104
          2.        105
      17. 5.3.16 MMC
        1.       MAIN Domain Instances
          1.        108
          2.        109
      18. 5.3.17 OSPI
        1.       MAIN Domain Instances
          1.        112
      19. 5.3.18 Power Supply
        1.       114
      20. 5.3.19 PRU_ICSSG
        1.       MAIN Domain Instances
          1.        117
          2.        118
      21. 5.3.20 Reserved
        1.       120
      22. 5.3.21 SERDES
        1.       MAIN Domain Instances
          1.        123
      23. 5.3.22 System and Miscellaneous
        1. 5.3.22.1 Boot Mode Configuration
          1.        MAIN Domain Instances
            1.         127
        2. 5.3.22.2 Clocking
          1.        MCU Domain Instances
            1.         130
        3. 5.3.22.3 SYSTEM
          1.        MAIN Domain Instances
            1.         133
          2.        MCU Domain Instances
            1.         135
        4. 5.3.22.4 VMON
          1.        137
      24. 5.3.23 TIMER
        1.       MAIN Domain Instances
          1.        140
        2.       MCU Domain Instances
          1.        142
      25. 5.3.24 UART
        1.       MAIN Domain Instances
          1.        145
          2.        146
          3.        147
          4.        148
          5.        149
          6.        150
          7.        151
        2.       MCU Domain Instances
          1.        153
          2.        154
      26. 5.3.25 USB
        1.       MAIN Domain Instances
          1.        157
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  eMMCPHY Electrical Characteristics
      5. 6.7.5  SDIO Electrical Characteristics
      6. 6.7.6  LVCMOS Electrical Characteristics
      7. 6.7.7  ADC12B Electrical Characteristics (ALV package)
      8. 6.7.8  ADC10B Electrical Characteristics (ALX package)
      9. 6.7.9  USB2PHY Electrical Characteristics
      10. 6.7.10 SerDes PHY Electrical Characteristics
      11. 6.7.11 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Requirements
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Power Supply Sequencing
          1. 6.10.2.2.1 Power-Up Sequencing
          2. 6.10.2.2.2 Power-Down Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input Clocks / Oscillators
          1. 6.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.10.5 Peripherals
        1. 6.10.5.1  CPSW3G
          1. 6.10.5.1.1 CPSW3G MDIO Timing
          2. 6.10.5.1.2 CPSW3G RMII Timing
          3. 6.10.5.1.3 CPSW3G RGMII Timing
          4. 6.10.5.1.4 CPSW3G IOSETs
        2. 6.10.5.2  DDRSS
        3. 6.10.5.3  ECAP
        4. 6.10.5.4  EPWM
        5. 6.10.5.5  EQEP
        6. 6.10.5.6  FSI
        7. 6.10.5.7  GPIO
        8. 6.10.5.8  GPMC
          1. 6.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 6.10.5.8.4 GPMC0 IOSETs (ALV)
        9. 6.10.5.9  I2C
        10. 6.10.5.10 MCAN
        11. 6.10.5.11 MCSPI
          1. 6.10.5.11.1 MCSPI — Controller Mode
          2. 6.10.5.11.2 MCSPI — Peripheral Mode
        12. 6.10.5.12 MMCSD
          1. 6.10.5.12.1 MMC0 - eMMC Interface
            1. 6.10.5.12.1.1 Legacy SDR Mode
            2. 6.10.5.12.1.2 High Speed SDR Mode
            3. 6.10.5.12.1.3 High Speed DDR Mode
            4. 6.10.5.12.1.4 HS200 Mode
          2. 6.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.12.2.1 Default Speed Mode
            2. 6.10.5.12.2.2 High Speed Mode
            3. 6.10.5.12.2.3 UHS–I SDR12 Mode
            4. 6.10.5.12.2.4 UHS–I SDR25 Mode
            5. 6.10.5.12.2.5 UHS–I SDR50 Mode
            6. 6.10.5.12.2.6 UHS–I DDR50 Mode
            7. 6.10.5.12.2.7 UHS–I SDR104 Mode
        13. 6.10.5.13 CPTS
        14. 6.10.5.14 OSPI
          1. 6.10.5.14.1 OSPI0 PHY Mode
            1. 6.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 6.10.5.14.1.2 OSPI0 Without Data Training
              1. 6.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 6.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 6.10.5.14.2 OSPI0 Tap Mode
            1. 6.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 6.10.5.15 PCIe
        16. 6.10.5.16 PRU_ICSSG
          1. 6.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 6.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 6.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 6.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 6.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 6.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 6.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 6.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 6.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 6.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 6.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 6.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 6.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 6.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 6.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 6.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 6.10.5.17 Timers
        18. 6.10.5.18 UART
        19. 6.10.5.19 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 7.2.2 Arm Cortex-M4F (M4FSS)
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 7.4 Other Subsystems
      1. 7.4.1 PDMA Controller
      2. 7.4.2 Peripherals
        1. 7.4.2.1  ADC
        2. 7.4.2.2  DCC
        3. 7.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 7.4.2.4  ECAP
        5. 7.4.2.5  EPWM
        6. 7.4.2.6  ELM
        7. 7.4.2.7  ESM
        8. 7.4.2.8  GPIO
        9. 7.4.2.9  EQEP
        10. 7.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 7.4.2.11 I2C
        12. 7.4.2.12 MCAN
        13. 7.4.2.13 MCRC Controller
        14. 7.4.2.14 MCSPI
        15. 7.4.2.15 MMCSD
        16. 7.4.2.16 OSPI
        17. 7.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 7.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 7.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 7.4.2.20 Dual Mode Timer (DMTIMER)
        21. 7.4.2.21 UART
        22. 7.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 General Routing Guidelines
      2. 8.2.2 DDR Board Design and Layout Guidelines
      3. 8.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.3.2 External Board Loopback
        3. 8.2.3.3 DQS (only available in Octal SPI devices)
      4. 8.2.4 USB VBUS Design Guidelines
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 High Speed Differential Signal Routing Guidance
      7. 8.2.7 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
      2. 8.3.2 Oscillator Ground Connection
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
      1. 9.3.1 Information About Cautions and Warnings
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
  • ALX|293
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from January 30, 2023 to May 1, 2024 (from Revision F (January 2023) to Revision G (May 2024))

  • (Features): Updated ALX package description from SIP to OvermoldedGo
  • (Features): Updated/Changed the Functional Safety bullets to include the received Functional Safety-Compliant certificationGo
  • Global: Moved the Revision History section to the back of the documentGo
  • (Applications): Adding Factory Automation Robots, Industrial & Collaborative Robots, Industrial Mobile Robots, and Home Automation Robots bulletsGo
  • (Pin Connectivity Requirements): Updated the second paragraph of the note following the Connectivity Requirements table. The update clarifies the operation of configurable device IOs and includes precautions that must be taken to prevent floating signals from damaging device input buffersGo
  • (Speed Grade Maximum Frequency): Increased ICSSG from 250MHz to 333MHz for Speed Grade KGo
  • (SDIO Electrical Characteristics): Changed VDDSHV5 power rail name, where applicable, used to define the VIL/VILSS/VIH/VIHSS/VOL/VOH parameter values by referencing a generic power rail name (VDD), and added an associated table noteGo
  • (DDR Electrical Characteristics): Added references to the respective JEDEC standardsGo
  • (Power-Up Sequencing): Separated VDDSHV5 in Power-Up Sequencing diagram with footnote to clarify the power rail supports power-up, power-down, or dynamic voltage change without any dependency on other power rails.Go
  • (Power-Down Sequencing): Separated VDDSHV5 in Power-Down Sequencing diagram with footnote to clarify the power rail supports power-up, power-down, or dynamic voltage change without any dependency on other power rails.Go
  • (Reset Timing Conditions): Changed the Input slew rate minimum values for VDD = 1.8V and VDD = 3.3V (original values were swapped)Go
  • (MCU_RESETSTATz, and RESETSTATz Switching Characteristics): Changed the minimum value of parameter RST13 from "0" to "960".Go
  • (CPSW3G MDIO Timing): Included PCB Connectivity Requirements in the Timing Conditions table, changed the minimum setup time value (parameter MDIO1) from "90" to "45", and changed the minimum and maximum output delay time values (parameter MDIO7) from "-150" and "150" to "-10" and "10" respectivelyGo
  • (MCSPI Switching Characteristics - Controller Mode): Replaced previous table notes 2 and 3 with new table notes 2, 3, 4, and 5Go
  • (Switching Characteristics for MMC1 – UHS-I SDR104 Mode): Changed the minimum values for SDR1046 and SDR1047 from 2.08 to 2.12, the minimum values for SDR1048 and SDR1049 from 1.12 to 1.08, and maximum values for SDR1048 and SDR1049 from 3.16 to 3.2Go
  • (OSPI Switching Characteristics – PHY Data Training): Added maximum values to the OSPI0_CLK Cycle Time parameter (O1) to define a minimum operating frequency of 133MHz. Also updated Note 1 and Note 4, where "in ns" was added to the OSPI_CLK cycle time reference in Note 1 and "refclk" was changed to "reference clock" in Note 4 so it matches the clock name used in the TRMGo
  • (OSPI0 Switching Characteristics – PHY SDR Mode): Updated Note 1 and Note 4, where "in ns" was added to the OSPI_CLK cycle time reference in Note 1 and "refclk" was changed to "reference clock" in Note 4 so it matches the clock name used in the TRMGo
  • (OSPI0 Switching Characteristics – PHY DDR Mode): Updated Note 1 and Note 4, where "in ns" was added to the OSPI_CLK cycle time reference in Note 1 and "refclk" was changed to "reference clock" in Note 4 so it matches the clock name used in the TRMGo
  • (OSPI0 Timing Requirements – Tap SDR Mode): Updated the constant values associated with the minimum setup and minimum hold formulas in parameters O19 and O20. Note 2 was also updated to change "refclk" to "reference clock" so it matches the clock name used in the TRMGo
  • (OSPI0 Switching Characteristics – Tap SDR Mode): Updated Note 1 and Note 4, where "in ns" was added to the OSPI_CLK cycle time reference in Note 1 and "refclk" was changed to "reference clock" in Note 4 so it matches the clock name used in the TRMGo
  • (OSPI0 Timing Requirements – Tap DDR Mode): Updated the constant values associated with the minimum setup and minimum hold formulas in parameters O13 and O14. Note 2 was also updated to change "refclk" to "reference clock" so it matches the clock name used in the TRMGo
  • (OSPI0 Switching Characteristics – Tap DDR Mode): Updated the minimum data output delay and maximum data output delay formulas in parameter O6. Also updated Note 1 and Note 5, where "in ns" was added to the OSPI_CLK cycle time reference in Note 1 and "refclk" was changed to "reference clock" in Note 5 so it matches the clock name used in the TRMGo
  • (PCIe): Updated the "For more details about features and ..." paragraph.Go
  • (PRUSS PRU Switching Characteristics – Direct Output Mode): Changed the maximum skew value for the GPO to GPO parameter (PRDO1) from 3ns to 2nsGo
  • (PRU_ICSSG UART Switching Characteristics): Added the TRM UART baud rate settings reference to Note 1Go
  • (USB): Updated the "For more details about features and ..." paragraph.Go
  • (USB VBUS Design Guidelines): Changed the 3.5 kΩ resistor value to 3.48kΩ since 3.5kΩ is not a standard value for 1% resistorsGo