SLUS763D July   2007  – April 2016

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Down
      2. 7.3.2 Power-On Reset
      3. 7.3.3 Operation
        1. 7.3.3.1 Input Overvoltage Protection
        2. 7.3.3.2 Input Overcurrent Protection
        3. 7.3.3.3 Battery Overvoltage Protection
        4. 7.3.3.4 Thermal Protection
        5. 7.3.3.5 Enable Function
        6. 7.3.3.6 Fault Indication
    4. 7.4 Device Functional Modes
      1. 7.4.1 OPERATION Mode
      2. 7.4.2 POWER-DOWN Mode
      3. 7.4.3 POWER-ON RESET Mode
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selection of RBAT
        2. 8.2.2.2 Selection of RCE, RFAULT, and RPU
        3. 8.2.2.3 Selection of Input and Output Bypass Capacitors
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Powering Accessories
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DSG Package
8-Pin WSON
Top View
DSJ Package
8-Pin VSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME VSON WSON
CE 7 5 I Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.
FAULT 4 4 O Open-drain output, device status. FAULT = Low indicates that the input FET Q1 has been turned off due to input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown.
ILIM 9 7 I/O Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent threshold.
IN 1, 2 1 I Input power, connect to external DC supply. Connect external 1-μF ceramic capacitor (minimum) to VSS. For the 12-pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the PCB at the device.
NC 5, 6, 12 3 These pins may have internal circuits used for test purposes. Do not make any external connections at these pins for normal operation.
OUT 10, 11 8 O Output terminal to the charging system. Connect external 1-μF ceramic capacitor (minimum) to VSS.
Thermal PAD There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin must be connected to ground at all times.
VBAT 8 6 I Battery voltage sense input. Connect to pack positive terminal through a resistor.
VSS 3 2 Ground terminal