SLUSAH0G october   2011  – august 2023 BQ25504

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Maximum Power Point Tracking
      2. 8.3.2 Battery Undervoltage Protection
      3. 8.3.3 Battery Overvoltage Protection
      4. 8.3.4 Battery Voltage in Operating Range (VBAT_OK Output)
      5. 8.3.5 Nano-Power Management and Efficiency
    4. 8.4 Device Functional Modes
      1. 8.4.1 Cold-Start Operation (VSTOR < VSTOR_CHGEN, VIN_DC > VIN(CS) and PIN > PIN(CS))
      2. 8.4.2 Main Boost Charger Enabled (VSTOR > VSTOR_CHGEN, VIN_DC > VIN(DC) and EN = LOW )
      3. 8.4.3 Thermal Shutdown
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Storage Element Selection
      2. 9.1.2 Inductor Selection
      3. 9.1.3 Capacitor Selection
        1. 9.1.3.1 VREF_SAMP Capacitance
        2. 9.1.3.2 VIN_DC Capacitance
        3. 9.1.3.3 VSTOR Capacitance
        4. 9.1.3.4 Additional Capacitance on VSTOR or VBAT
    2. 9.2 Typical Applications
      1. 9.2.1 Solar Application Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TEG Application Circuit
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 MPPT Disabled, Low Impedance Source Application Circuit
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Zip Files
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision F (November 2019) to Revision G (August 2023)

  • Added "Connect to thermal pad." to AVSS and VSS pin descriptions in Pin Functions tableGo
  • Added lines from AVSS and VSS to GND in Figure 11-1 Go

Changes from Revision E (March 2019) to Revision F (November 2019)

  • Deleted Not Recommended for New Designs Go

Changes from Revision D (December 2018) to Revision E (March 2019)

  • Changed Feature From: VIN ≥ 80 mV (Typical) To: VIN ≥ 130 mV (Typical)Go
  • Changed From: VIN as low as 330 mV To: VIN as low as 600 mV in the Description Go
  • Changed From: "harvest energy down to VIN = 80 mV." To: "harvest energy down to VIN = 130 mV." in the Description Go
  • Changed From: "330 mV typical,.." To: "600 mV typical,.." in the second paragraph of the Overview sectionGo
  • Changed Figure 8-1 Go
  • Changed From: "VIN(CS) = 330 mV typical." To: "VIN(CS) = 600 mV typical." in the second paragraph of the Cold-Start Operation sectionGo

Changes from Revision C (June 2015) to Revision D (December 2018)

  • Changed Feature From: Cold-Start Voltage: VIN ≥ 330 mV (Typical) To: Cold-Start Voltage: VIN ≥ 600 mV (Typical) Go
  • Changed the RGT Package appearance Go
  • Moved Tstg to the Absolute Maximum Ratings tableGo
  • Changed Handling Ratings To: ESD Ratings Go
  • Increased VIN(CS) From: TYP = 330 mV and MAX = 450 mV To: TYP = 600 mV and MAX = 700 mV in Section 7.5 tableGo

Changes from Revision B (December 2014) to Revision C (June 2015)

Changes from Revision A (September 2012) to Revision B (December 2014)

  • Changed revision B date from September 2014 to November 2014 Go
  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed the TextNote>TabbedText> under the Typical Characterisitcs graphics from 3 columns 1 row to 1 column 3 rows Go
  • Changed VRDIV to VIN_DC.Go
  • Changed equations from paragraphs to Equation wrappers so they will have an equation numberGo
  • Changed "Refer to SLUC41 for a design example" To: "Refer to SLUC463 for a design example" in the Storage Element Selection sectionGo

Changes from Revision * (October 2011) to Revision A (September 2012)

  • Changed the Cold -Start Operation sectionGo
  • Changed the Boost Converter, Charger Operation sectionGo
  • Changed the Storage Element sectionGo
  • Changed the CAPACITOR SELECTION sectionGo
  • Added CFLTR and Notes 1 and 2 to Figure 9-1 Go
  • Added CFLTR and Notes 1 and 2 to Figure 9-8 Go
  • Added CFLTR and Notes 1 and 2 to Figure 9-15 Go