SLUSDW2A November   2021  – February 2022 BQ27Z746

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1 Supply Current
      2. 6.5.2 Common Analog (LDO, LFO, HFO, REF1, REF2, I-WAKE)
      3. 6.5.3 Battery Protection (CHG, DSG)
      4. 6.5.4 Cell Sensing Output (BAT_SP, BAT_SN)
      5. 6.5.5 Gauge Measurements (ADC, CC, Temperature)
      6. 6.5.6 Flash Memory
    6. 6.6 Digital I/O: DC Characteristics
    7. 6.7 Digital I/O: Timing Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  BQ27Z746 Processor
      2. 7.3.2  Battery Parameter Measurements
        1. 7.3.2.1 Coulomb Counter (CC) and Digital Filter
        2. 7.3.2.2 ADC Multiplexer
        3. 7.3.2.3 Analog-to-Digital Converter (ADC)
        4. 7.3.2.4 Internal Temperature Sensor
        5. 7.3.2.5 External Temperature Sensor Support
      3. 7.3.3  Power Supply Control
      4. 7.3.4  Bus Communication Interface
      5. 7.3.5  Low Frequency Oscillator
      6. 7.3.6  High Frequency Oscillator
      7. 7.3.7  1.8-V Low Dropout Regulator
      8. 7.3.8  Internal Voltage References
      9. 7.3.9  Overcurrent in Discharge Protection
      10. 7.3.10 Overcurrent in Charge Protection
      11. 7.3.11 Short-Circuit Current in Discharge Protection
      12. 7.3.12 Primary Protection Features
      13. 7.3.13 Battery Sensing
      14. 7.3.14 Gas Gauging
      15. 7.3.15 Zero Volt Charging (ZVCHG)
      16. 7.3.16 Charge Control Features
      17. 7.3.17 Authentication
    4. 7.4 Device Functional Modes
      1. 7.4.1 Lifetime Logging Features
      2. 7.4.2 Configuration
        1. 7.4.2.1 Coulomb Counting
        2. 7.4.2.2 Cell Voltage Measurements
        3. 7.4.2.3 Auto Calibration
        4. 7.4.2.4 Temperature Measurements
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements (Default)
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Changing Design Parameters
      3. 8.2.3 Calibration Process
      4. 8.2.4 Gauging Data Updates
        1. 8.2.4.1 Application Curve
  9. 9 Power Supply Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Orderable, and Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YAH|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Digital I/O: DC Characteristics

Unless otherwise noted, characteristics noted under conditions of TA = –40 to 85℃, VREG18 = 1.8 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I2C Pins (SCL, SDA/HDQ)
VIH High-level input voltage SCL, SDA pins 1.26 V
VIL Low-level input voltage low SCL, SDA pins 0.54 V
VOL Low-level output voltage SCL, SDA pins, IOL = 1 mA 0.36 V
CI Input capacitance SCL, SDA pins 10 pF
Ilkg Input leakage current SCL, SDA pins 1 µA
Push-Pull Pins (GPO)
VIH High-level input voltage Push-Pull pins 1.15 V
VIL Low-level input voltage low Push-Pull pins 0.54 V
VOH Output voltage high Push-Pull pins, IOH = -1 mA 1.08 V
VOL Output voltage low Push-Pull pins, IOL = 1 mA 0.36 V
CI Input capacitance Push-Pull pins 10 pF
Ilkg Input leakage current Push-Pull pins 1 µA