SLUS987C January   2011  – December 2019 BQ33100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: General Purpose I/O
    6. 7.6  Supply Current
    7. 7.7  REG27 LDO
    8. 7.8  Coulomb Counter
    9. 7.9  ADC
    10. 7.10 External Capacitor Voltage Balance Drive
    11. 7.11 Capacitor Voltage Monitor
    12. 7.12 Internal Temperature Sensor
    13. 7.13 Thermistor Measurement Support
    14. 7.14 Internal Thermal Shutdown
    15. 7.15 High-Frequency Oscillator
    16. 7.16 Low-Frequency Oscillator
    17. 7.17 RAM Backup
    18. 7.18 Flash
    19. 7.19 Current Protection Thresholds
    20. 7.20 Current Protection Timing
    21. 7.21 Timing Requirements: SMBus
    22. 7.22 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Super Capacitor Measurements
        1. 8.1.1.1 Voltage
        2. 8.1.1.2 Current, Charge, and Discharge Counting
        3. 8.1.1.3 Device Calibration
        4. 8.1.1.4 Temperature
        5. 8.1.1.5 Series Capacitor Configuration
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Capacitance Monitoring and Learning
        1. 8.3.1.1 Monitoring and Control Operational Overview
        2. 8.3.1.2 Main Monitoring Registers
        3. 8.3.1.3 Initial Capacitance at Device Reset
        4. 8.3.1.4 Qualified Capacitance Learning
        5. 8.3.1.5 Health Determination
        6. 8.3.1.6 ESR Measurement
        7. 8.3.1.7 Monitor Operating Modes
      2. 8.3.2 Capacitor Voltage Balancing
      3. 8.3.3 Charge Control
        1. 8.3.3.1 Charge Termination
        2. 8.3.3.2 CHG Override Control
      4. 8.3.4 Lifetime Data Gathering
        1. 8.3.4.1 Lifetime Maximum Temperature
        2. 8.3.4.2 Lifetime Minimum Temperature
        3. 8.3.4.3 Lifetime Maximum Capacitor Voltage
      5. 8.3.5 Safety Detection Features
        1. 8.3.5.1  Capacitor Overvoltage (OV)
        2. 8.3.5.2  Capacitor Voltage Imbalance (CIM)
        3. 8.3.5.3  Weak Capacitor (CLBAD)
        4. 8.3.5.4  Overtemperature (OT)
        5. 8.3.5.5  Overcurrent During Charging (OC Chg)
        6. 8.3.5.6  Overcurrent During Discharging (OC Dsg)
        7. 8.3.5.7  Short-Circuit During Charging (SC Chg)
        8. 8.3.5.8  Short-Circuit During Discharging (SC Dsg)
        9. 8.3.5.9  AFE Watchdog (WDF)
        10. 8.3.5.10 Integrated AFE Communication Fault (AFE_C)
        11. 8.3.5.11 Data Flash Fault (DFF)
        12. 8.3.5.12 FAULT Indication (FAULT Pin)
      6. 8.3.6 Communications
        1. 8.3.6.1 SMBus On and Off State
      7. 8.3.7 Security (Enables and Disables Features)
      8. 8.3.8 Measurement System Calibration
        1. 8.3.8.1  Coulomb Counter Deadband
        2. 8.3.8.2  Auto Calibration
        3. 8.3.8.3  Current Gain
        4. 8.3.8.4  CC Delta
        5. 8.3.8.5  Cap1 K-factor
        6. 8.3.8.6  Cap2 K-factor
        7. 8.3.8.7  Cap3 K-factor
        8. 8.3.8.8  Cap4 K-factor
        9. 8.3.8.9  Cap5 K-factor
        10. 8.3.8.10 K-factor Override Flag
        11. 8.3.8.11 System Voltage K-factor
        12. 8.3.8.12 Stack Voltage K-factor
        13. 8.3.8.13 K-factor Stack Override Flag
        14. 8.3.8.14 CC Offset
        15. 8.3.8.15 Board Offset
        16. 8.3.8.16 Int Temp Offset
        17. 8.3.8.17 Ext1 Temp Offset
        18. 8.3.8.18 CC Current
        19. 8.3.8.19 Voltage Signal
        20. 8.3.8.20 Temp Signal
        21. 8.3.8.21 CC Offset Time
        22. 8.3.8.22 ADC Offset Time
        23. 8.3.8.23 Current Gain Time
        24. 8.3.8.24 Voltage Time
        25. 8.3.8.25 Temperature Time
        26. 8.3.8.26 Cal Mode Timeout
        27. 8.3.8.27 Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
        28. 8.3.8.28 Rpad
        29. 8.3.8.29 Rint
        30. 8.3.8.30 Int Coef 1..4, Int Min AD, Int Max Temp
        31. 8.3.8.31 Filter
        32. 8.3.8.32 Deadband
        33. 8.3.8.33 CC Deadband
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Power Modes
    5. 8.5 Programming
      1. 8.5.1 Communications
        1. 8.5.1.1 BQ33100 Slave Address
        2. 8.5.1.2 SMBus On and Off State
        3. 8.5.1.3 Packet Error Checking
      2. 8.5.2 SBS Commands
        1. 8.5.2.1 SBS Command Summary
        2. 8.5.2.2 SBS Command Details
          1. 8.5.2.2.1  ManufacturerAccess (0x00)
            1. 8.5.2.2.1.1  Device Type (0x0001)
            2. 8.5.2.2.1.2  Firmware Version (0x0002)
            3. 8.5.2.2.1.3  Hardware Version (0x0003)
            4. 8.5.2.2.1.4  DF Checksum (0x0004)
            5. 8.5.2.2.1.5  Seal Device (0x0020)
            6. 8.5.2.2.1.6  Lifetime and Capacitor Balancing Enable (0x0021)
            7. 8.5.2.2.1.7  FAULT Activation (0x0030)
            8. 8.5.2.2.1.8  FAULT Clear (0x0031)
            9. 8.5.2.2.1.9  CHGLVL0 Activation (0x0032)
            10. 8.5.2.2.1.10 CHGLVL0 Clear (0x0033)
            11. 8.5.2.2.1.11 CHGLVL1 Activation (0x0033)
            12. 8.5.2.2.1.12 CHGLVL1 Clear (0x0034)
            13. 8.5.2.2.1.13 Learn Load Activation (0x0037)
            14. 8.5.2.2.1.14 Learn Load Clear (0x0038)
            15. 8.5.2.2.1.15 Calibration Mode (0x0040)
            16. 8.5.2.2.1.16 Reset (0x0041)
            17. 8.5.2.2.1.17 Unseal Device (UnsealKey)
            18. 8.5.2.2.1.18 Extended SBS Commands
          2. 8.5.2.2.2  Temperature (0x08)
          3. 8.5.2.2.3  Voltage (0x09)
          4. 8.5.2.2.4  Current (0x0A)
          5. 8.5.2.2.5  ESR (0x0B)
          6. 8.5.2.2.6  RelativeStateofCharge (0x0D)
          7. 8.5.2.2.7  Health (0x0E)
          8. 8.5.2.2.8  Capacitance (0x10)
          9. 8.5.2.2.9  ChargingCurrent (0x14)
          10. 8.5.2.2.10 ChargingVoltage (0x15)
          11. 8.5.2.2.11 CapacitorVoltage5..1 (0x3B..0x3F)
          12. 8.5.2.2.12 Extended SBS Commands
            1. 8.5.2.2.12.1 FETControl(0x46)
            2. 8.5.2.2.12.2 SafetyAlert (0x50)
            3. 8.5.2.2.12.3 SafetyStatus (0x51)
            4. 8.5.2.2.12.4 OperationStatus (0x54)
            5. 8.5.2.2.12.5 SystemVoltage (0x5a)
            6. 8.5.2.2.12.6 UnSealKey(0x60)
            7. 8.5.2.2.12.7 ManufacturerInfo(0x70)
      3. 8.5.3 Data Flash
        1. 8.5.3.1 Accessing Data Flash
        2. 8.5.3.2 Data Flash Interface
        3. 8.5.3.3 Data Flash Summary
        4. 8.5.3.4 Specific Data Flash Programming Details
          1. 8.5.3.4.1  OC Dsg
          2. 8.5.3.4.2  OC Dsg Time
          3. 8.5.3.4.3  SC Dsg Cfg
          4. 8.5.3.4.4  SC Chg Cfg
          5. 8.5.3.4.5  Initial 1st Capacitance
          6. 8.5.3.4.6  Capacitance
          7. 8.5.3.4.7  Firmware Version
          8. 8.5.3.4.8  Hardware Version
          9. 8.5.3.4.9  Manuf. Info
          10. 8.5.3.4.10 Operation Cfg
          11. 8.5.3.4.11 FET ACTION
          12. 8.5.3.4.12 FAULT
          13. 8.5.3.4.13 AFE State_CTL
          14. 8.5.3.4.14 Measurement Margin %
          15. 8.5.3.4.15 Max Dsg Time
          16. 8.5.3.4.16 V Chg Nominal
          17. 8.5.3.4.17 V Chg A
          18. 8.5.3.4.18 V Chg B
          19. 8.5.3.4.19 V Chg Max
          20. 8.5.3.4.20 Min Voltage
          21. 8.5.3.4.21 Learning Frequency
          22. 8.5.3.4.22 Dsg Current Threshold
          23. 8.5.3.4.23 Chg Current Threshold
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting Number of Series Capacitor Support
        2. 9.2.2.2 Selecting Charging Voltage Values
        3. 9.2.2.3 Learning Frequency Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.21 Timing Requirements: SMBus

Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to 85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
MIN NOM MAX UNIT
fSMB SMBus operating frequency Slave mode, SCL 50% duty cycle 10 100 kHz
fMAS SMBus master clock frequency Master mode, no clock low slave extend 51.2 kHz
tBUF Bus free time between start and stop 4.7 µs
tHD:STA Hold time after (repeated) start 4 µs
tSU:STA Repeated start setup time 4.7 µs
tSU:STO Stop setup time 4 µs
tHD:DAT Data hold time Receive mode 0 ns
Transmit mode 300
tSU:DAT Data setup time 250 ns
tTIMEOUT Error signal and detect See (1) 25 35 ms
tLOW Clock low period 4.7 µs
tHIGH Clock high period See (2) 4 50 µs
tLOW:SEXT Cumulative clock low slave extend time See (3) 25 ms
tLOW:MEXT Cumulative clock low master extend time See (4) 10 ms
tF Clock and data fall time See (5) 300 ns
tR Clock and data rise time See (6) 1000 ns
(1) The BQ33100 times out when any clock low exceeds tTIMEOUT.
(2) tHIGH maximum is the minimum bus idle time. SCL = SDA = 1 for t > 50 µs causes reset of any transaction involving BQ33100 that is in progress.
(3) tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
(4) tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
(5) Rise time tR = VILMAX – 0.15) to (VIHMIN + 0.15)
(6) Fall time tF = 0.9 VDD to (VILMAX – 0.15)
BQ33100 smbus_tim_1_lus928.gifFigure 1. SMBus Timing
BQ33100 smbus_timout1_lus928.gifFigure 2. SMBus tTIMEOUT