SLUSCS4C June   2017  – April 2021 BQ40Z50-R2

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Equivalent Diagrams
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current
    6. 7.6  Power Supply Control
    7. 7.7  AFE Power-On Reset
    8. 7.8  AFE Watchdog Reset and Wake Timer
    9. 7.9  Current Wake Comparator
    10. 7.10 VC1, VC2, VC3, VC4, BAT, PACK
    11. 7.11 SMBD, SMBC
    12. 7.12 PRES, BTP_INT, DISP
    13. 7.13 LEDCNTLA, LEDCNTLB, LEDCNTLC
    14. 7.14 Coulomb Counter
    15. 7.15 CC Digital Filter
    16. 7.16 ADC
    17. 7.17 ADC Digital Filter
    18. 7.18 CHG, DSG FET Drive
    19. 7.19 PCHG FET Drive
    20. 7.20 FUSE Drive
    21. 7.21 Internal Temperature Sensor
    22. 7.22 TS1, TS2, TS3, TS4
    23. 7.23 PTC, PTCEN
    24. 7.24 Internal 1.8-V LDO
    25. 7.25 High-Frequency Oscillator
    26. 7.26 Low-Frequency Oscillator
    27. 7.27 Voltage Reference 1
    28. 7.28 Voltage Reference 2
    29. 7.29 Instruction Flash
    30. 7.30 Data Flash
    31. 7.31 OLD, SCC, SCD1, SCD2 Current Protection Thresholds
    32. 7.32 Timing Requirements: OLD, SCC, SCD1, SCD2 Current Protection Timing
    33. 7.33 Timing Requirements: SMBus
    34. 7.34 Timing Requirements: SMBus XL
    35. 7.35 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Primary (1st Level) Safety Features
      2. 8.3.2  Secondary (2nd Level) Safety Features
      3. 8.3.3  Charge Control Features
      4. 8.3.4  Gas Gauging
      5. 8.3.5  Configuration
        1. 8.3.5.1 Oscillator Function
        2. 8.3.5.2 System Present Operation
        3. 8.3.5.3 Emergency Shutdown
        4. 8.3.5.4 1-Series, 2-Series, 3-Series, or 4-Series Cell Configuration
        5. 8.3.5.5 Cell Balancing
      6. 8.3.6  Battery Parameter Measurements
        1. 8.3.6.1 Charge and Discharge Counting
      7. 8.3.7  Battery Trip Point (BTP)
      8. 8.3.8  Lifetime Data Logging Features
      9. 8.3.9  Authentication
      10. 8.3.10 LED Display
      11. 8.3.11 IATA Support
      12. 8.3.12 Voltage
      13. 8.3.13 Current
      14. 8.3.14 Temperature
      15. 8.3.15 Communications
        1. 8.3.15.1 SMBus On and Off State
        2. 8.3.15.2 SBS Commands
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 High-Current Path
          1. 9.2.2.1.1 Protection FETs
          2. 9.2.2.1.2 Chemical Fuse
          3. 9.2.2.1.3 Li-Ion Cell Connections
          4. 9.2.2.1.4 Sense Resistor
          5. 9.2.2.1.5 ESD Mitigation
        2. 9.2.2.2 Gas Gauge Circuit
          1. 9.2.2.2.1 Coulomb-Counting Interface
          2. 9.2.2.2.2 Power Supply Decoupling and PBI
          3. 9.2.2.2.3 System Present
          4. 9.2.2.2.4 SMBus Communication
          5. 9.2.2.2.5 FUSE Circuitry
        3. 9.2.2.3 Secondary-Current Protection
          1. 9.2.2.3.1 Cell and Battery Inputs
          2. 9.2.2.3.2 External Cell Balancing
          3. 9.2.2.3.3 PACK and FET Control
          4. 9.2.2.3.4 Temperature Output
          5. 9.2.2.3.5 LEDs
          6. 9.2.2.3.6 Safety PTC Thermistor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Protector FET Bypass and Pack Terminal Bypass Capacitors
      2. 11.1.2 ESD Spark Gap
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
      2. 12.2.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.2.2.3 System Present

The system present signal informs the gas gauge whether the pack is installed into or removed from the system. In the host system, this pin is grounded. The PRES pin of the BQ40Z50-R2 device is occasionally sampled to test for system present. In ACTIVE mode, the PRES pin is pulsed every 250 ms for a duration of 5 ms (RHOEN is on), and just before it is turned off, the state of the PRES pin is checked to see if it is low or high. The average of the four measurements is used to determine if the PRES is asserted or not. In SLEEP mode, the PRES pin is pulsed every "Sleep Voltage Time," and the state of the PRES pin is determined. A resistor can be used to pull the signal low and the resistance must be 20 kΩ or lower to ensure that the test pulse is lower than the VIL limit. The pullup current source is typically 10 µA to 20 µA. When the PRES pin is not pulsed, the PRES pin is tied internally to VSS (RHOUT is on), and any pullup on the PRES pin will cause a battery drain when not charging. Refer to the PRES pin diagram in

GUID-55E25D76-07DF-4AE8-AD3E-A6BCC95B17EE-low.gifFigure 9-8 System Present Pull-Down Resistor

Because the System Present signal is part of the pack connector interface to the outside world, it must be protected from external electrostatic discharge events. The PRES pin has integrated ESD protection to 2 kV. External protection can be added to support higher ESD protection requirements. The TPD1E10B06 single-channel ESD protection diode (U2) can protect the input up to 30 kV, and the R8 reduces the holding current to release the internal SCR in the event that it triggers.

GUID-9BB9C632-BB3A-4B31-AFA6-F1E7068367BC-low.gifFigure 9-9 System Present ESD and Short Protection