SLUSBZ1B October   2014  – March 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  A29 Coil Specification
      2. 7.3.2  Option Select Pins
      3. 7.3.3  LED Modes
      4. 7.3.4  FOD and Parasitic Metal Object Detect (PMOD) Calibration
      5. 7.3.5  FOD Ping Calibration
      6. 7.3.6  Shut Down Through External Thermal Sensor or Trigger
      7. 7.3.7  Fault Handling and Indication
      8. 7.3.8  Power Transfer Start Signal
      9. 7.3.9  Power-On Reset
      10. 7.3.10 External Reset, RESET Pin
      11. 7.3.11 Trickle Charge and CS100
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Transfer
      2. 7.4.2 Communication
      3. 7.4.3 Power Trains
      4. 7.4.4 Power Train Voltage Control
      5. 7.4.5 Signal Processing Components
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Current Monitoring Requirements
        3. 8.2.2.3 All Unused Pins
        4. 8.2.2.4 Input Regulators
        5. 8.2.2.5 Input Power Requirements
        6. 8.2.2.6 LED Mode
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

  1. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com/
  2. Analog applications journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill, SLYT401
  3. Data sheet, Qi Compliant Wireless Power Transmitter Manager, SLUSAL8
  4. Data sheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, SLVSAT9
  5. Data sheet, bq51025 WPC v1.1 Compliant Single Chip Wireless Power Receiver With Proprietary 10-W Power Delivery, SLUSBX7
  6. Application note, Building a Wireless Power Transmitter, SLUA635
  7. Application note, bqTESLA Transmitter Coil Vendors, SLUA649

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.