SLUSBX7C September   2014  – March 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Dynamic Rectifier Control
      2. 8.3.2  Dynamic Power Scaling
      3. 8.3.3  VO_REG Calculations
      4. 8.3.4  RILIM Calculations
      5. 8.3.5  Adapter Enable Functionality
      6. 8.3.6  Turning Off the Transmitter
        1. 8.3.6.1 WPC v1.2 EPT
      7. 8.3.7  Communication Current Limit
      8. 8.3.8  PD_DET and TMEM
      9. 8.3.9  TS/CTRL
      10. 8.3.10 PMODE Pin
      11. 8.3.11 I2C Communication
      12. 8.3.12 Input Overvoltage
      13. 8.3.13 Alignment Aid Using Frequency Information
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1  Wireless Power Supply Current Register 1
      2. 8.5.2  Wireless Power Supply Current Register 2
      3. 8.5.3  Wireless Power Supply Current Register 3
      4. 8.5.4  I2C Mailbox Register
      5. 8.5.5  I2C Mailbox Register 2
      6. 8.5.6  I2C Mailbox Register 3
      7. 8.5.7  Wireless Power Supply FOD RAM
      8. 8.5.8  Wireless Power User Header RAM
      9. 8.5.9  Wireless Power USER VRECT Status RAM
      10. 8.5.10 Wireless Power VOUT Status RAM
      11. 8.5.11 Wireless Power Proprietary Mode REC PWR MSByte Status RAM
      12. 8.5.12 Wireless Power REC PWR LSByte Status RAM
      13. 8.5.13 Wireless Power Prop Packet Payload RAM Byte 0
      14. 8.5.14 Wireless Power Prop Packet Payload RAM Byte 1
      15. 8.5.15 Wireless Power Prop Packet Payload RAM Byte 2
      16. 8.5.16 Wireless Power Prop Packet Payload RAM Byte 3
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 WPC v1.2 Power Supply 7-V Output With 1.4-A Maximum Current With I2C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Output Voltage Set Point
          2. 9.2.1.2.2 Output and Rectifier Capacitors
          3. 9.2.1.2.3 TMEM
          4. 9.2.1.2.4 Maximum Output Current Set Point
          5. 9.2.1.2.5 I2C
          6. 9.2.1.2.6 Communication Current Limit
          7. 9.2.1.2.7 Receiver Coil
          8. 9.2.1.2.8 Series and Parallel Resonant Capacitors
          9. 9.2.1.2.9 Communication, Boot, and Clamp Capacitors
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Standalone 10-V WPC v1.2 Power Supply With 1-A Maximum Output Current in System Board
      3. 9.2.3 Standalone 10-V Power Supply With 1-A Maximum Output Current for 2S Charging System
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1  Output Voltage Set Point
          2. 9.2.3.2.2  Output and Rectifier Capacitors
          3. 9.2.3.2.3  TMEM
          4. 9.2.3.2.4  Maximum Output Current Set Point
          5. 9.2.3.2.5  I2C
          6. 9.2.3.2.6  Communication Current Limit
          7. 9.2.3.2.7  Receiver Coil
          8. 9.2.3.2.8  Series Resonant Capacitors
            1. 9.2.3.2.8.1 Tuning Procedure
          9. 9.2.3.2.9  Communication, Boot, and Clamp Capacitors
          10. 9.2.3.2.10 VRECT Clamp
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.