SLUSEQ7 October   2023 BQ77205

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Fault Detection
      2. 7.3.2 Open Wire Fault Detection
      3. 7.3.3 Oscillator Health Check
      4. 7.3.4 Sense Positive Input for Vx
      5. 7.3.5 Output Drive, OUT
      6. 7.3.6 The LATCH Function
      7. 7.3.7 Supply Input, VDD
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 FAULT Mode
      3. 7.4.3 Customer Test Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Cell Connection Sequence
    2. 8.2 Systems Example
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) BQ77205 UNIT
DGK
8 PINS
RθJA Junction-to-ambient thermal resistance 180 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55 °C/W
RθJB Junction-to-board thermal resistance 130 °C/W
ΨJT Junction-to-top characterization parameter 12.3 °C/W
ΨJB Junction-to-board characterization parameter 96.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.