SWRS177B February   2015  – July 2016 CC2630

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    7. 5.7  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 5.12 ADC Characteristics
    13. 5.13 Temperature Sensor
    14. 5.14 Battery Monitor
    15. 5.15 Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17 Programmable Current Source
    18. 5.18 Synchronous Serial Interface (SSI)
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Resistance Characteristics
    21. 5.21 Timing Requirements
    22. 5.22 Switching Characteristics
    23. 5.23 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Community Resources
    7. 8.7  Additional Information
    8. 8.8  Trademarks
    9. 8.9  Electrostatic Discharge Caution
    10. 8.10 Export Control Notice
    11. 8.11 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

7.1 Application Information

Very few external components are required for the operation of the CC2630 device. This section provides some general information about the various configuration options when using the CC2630 in an application, and then shows two examples of application circuits with schematics and layout. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.

Figure 7-1 shows the various RF front-end configuration options. The RF front end can be used in differential- or single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.

CC2630 CC26xx_Application_Circuit.gif Figure 7-1 CC2630 Application Circuit

Figure 7-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 8.3).

CC2630 CC26XX_Int_Ext_reg_may15.gif Figure 7-2 Supply Voltage Configurations

7.2 5 × 5 External Differential (5XD) Application Circuit

CC2630 circuit_1_external_differential_swrs178.gif Figure 7-3 5 × 5 External Differential (5XD) Application Circuit

7.2.1 Layout

CC2630 layout_5XD_swrs178.png Figure 7-4 5 × 5 External Differential (5XD) Layout

7.3 4 × 4 External Single-ended (4XS) Application Circuit

CC2630 circuit_2_external_single-ended_swrs178.gif Figure 7-5 4 × 4 External Single-ended (4XS) Application Circuit

7.3.1 Layout

CC2630 layout_app_circuit_02_4XS_v2.png Figure 7-6 4 × 4 External Single-ended (4XS) Layout