SCHS157D February   1998  – February 2022 CD54HC166 , CD54HCT166 , CD74HC166 , CD74HCT166

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings (1)
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Prerequisite for Switching Characteristics
    6. 5.6 Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Description

The ’HC166 and ’HCT166 8-bit shift register is fabricated with silicon gate CMOS technology. It possesses the low power consumption of standard CMOS integrated circuits, and can operate at speeds comparable to the equivalent low power Schottky device.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
CD54HC166F3A CDIP (16) 24.38 mm × 6.92 mm
CD54HCT166F3A CDIP (16) 24.38 mm × 6.92 mm
CD74HC166M SOIC (16) 9.90 mm × 3.90 mm
CD74HCT166M SOIC (16) 9.90 mm × 3.90 mm
CD74HC166E PDIP (16) 19.31 mm × 6.35 mm
CD74HCT166E PDIP (16) 19.31 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20211111-SS0I-X72S-2JPN-M1PFBQ2JC7SP-low.gif Functional Diagram