SLPS444C July   2013  – January 2016 CSD18563Q5A

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5A Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q5A Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQJ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (January 2015) to C Revision

Changes from A Revision (January 2014) to B Revision

  • Increased silicon limited continuous drain current to 93 A Go
  • Increased Pulsed Drain Current to 251 Go
  • Added line for max power dissipation with case temperature held to 25° CGo
  • Updated pulsed current conditions Go
  • Changed Figure 1 to normalized RθJC curve Go
  • Updated SOA in Figure 10 Go

Changes from * Revision (July 2013) to A Revision

  • Added more information to descriptionGo
  • Added small reel order numberGo
  • Removed TC = 25°C condition from continuous drain current (package limited) in Absolute Maximum Ratings tableGo
  • Changed Typ RθJA = 99°C/W to: RθJA = 100°C/W in Figure 1 Go
  • Added the Recommended Stencil Opening sectionGo