SLPS431B June   2013  – December  2014 CSD22202W15

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 CSD22202W15 Package Dimensions
    2. 7.2 Recommended Land Pattern
    3. 7.3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZF|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 CSD22202W15 Package Dimensions

M0171-01_LPS213.gif
All dimensions are in mm (unless otherwise specified)

Table 1. Pinout

POSITION DESIGNATION
A1 Gate
A2, A3, B1, B2, B3 Source
C1, C2, C3 Drain

7.2 Recommended Land Pattern

M0172-01_LPS213.gif
All dimensions are in mm (unless otherwise specified)

7.3 Tape and Reel Information

M0173-01_LPS213.gif
1. 10-sprocket hole-pitch cumulative tolerance ±0.2
 2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm
 3. Material: black static-dissipative polystyrene
 4. All dimensions are in mm (unless otherwise specified).
 5. Thickness: 0.30 ±0.05 mm
 6. MSL1 260°C (IR and convection) PbF-reflow compatible