SNAS364F May   2006  – April 2016 DAC102S085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Output Amplifiers
      3. 8.3.3 Reference Voltage
      4. 8.3.4 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Input Shift Register
      3. 8.5.3 DSP and Microprocessor Interfacing
        1. 8.5.3.1 ADSP-2101 and ADSP-2103 Interfacing
        2. 8.5.3.2 80C51 and 80L51 Interface
        3. 8.5.3.3 68HC11 Interface
        4. 8.5.3.4 Microwire Interface
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Bipolar Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4130
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

For best accuracy and minimum noise, the printed-circuit board containing the DAC102S085 should have separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes. Both of these planes should be located in the same board layer. There should be a single ground plane. A single ground plane is preferred if digital return current does not flow through the analog ground area. Frequently a single ground plane design uses a fencing technique to prevent the mixing of analog and digital ground current. Separate ground planes must only be used when the fencing technique is inadequate. The separate ground planes must be connected in one place, preferably near the DAC102S085. Special care is required to ensure that digital signals with fast edge rates do not pass over split ground planes. They must always have a continuous return path below their traces.

The DAC102S085 power supply should be bypassed with a 10-µF and a 0.1-µF capacitor as close as possible to the device with the 0.1-µF capacitor right at the device supply pin. The 10-µF capacitor should be a tantalum type and the 0.1-µF capacitor should be a low ESL, low ESR type. The power supply for the DAC102S085 should only be used for analog circuits.

Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the board. The clock and data lines should have controlled impedances.

11.2 Layout Example

DAC102S085 layout_snas364.gif Figure 44. DAC102S085 Layout Diagram