SBAS490B December   2011  – May 2015 DAC1282

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements: Serial Peripheral Interface (SPI) Timing
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1  Signal Output (VOUTP, VOUTN)
      2. 8.2.2  DAC Modes
        1. 8.2.2.1 Sine Mode
        2. 8.2.2.2 DC Mode
        3. 8.2.2.3 Pulse Mode
        4. 8.2.2.4 Digital Data Mode
      3. 8.2.3  Reference Voltage (VREF)
      4. 8.2.4  Output Filter (CAPP, CAPN)
      5. 8.2.5  Output Switch (SWINP, SWINN, SWOUTP, SWOUTN)
      6. 8.2.6  Clock Input (CLK)
      7. 8.2.7  Switch Control/External Digital Input (SW/TD)
        1. 8.2.7.1 SW Function
        2. 8.2.7.2 TD Function
      8. 8.2.8  SYNC
      9. 8.2.9  RESET/PWDN
      10. 8.2.10 AVDD, AVSS, and DVDD Power Supplies
        1. 8.2.10.1 Power Consumption
        2. 8.2.10.2 Offset and Gain Error
        3. 8.2.10.3 Signal-to-Noise Ratio (SNR)
        4. 8.2.10.4 DC Noise
        5. 8.2.10.5 Total Harmonic Distortion (THD)
      11. 8.2.11 Step Response
      12. 8.2.12 Frequency Response
    3. 8.3 Device Functional Modes
      1. 8.3.1 Serial Interface
        1. 8.3.1.1 Serial Communications
        2. 8.3.1.2 Chip Select (CS)
        3. 8.3.1.3 Serial Clock (SCLK)
        4. 8.3.1.4 Data Input (DIN)
        5. 8.3.1.5 Data Output (DOUT)
      2. 8.3.2 SPI Timeout
    4. 8.4 Programming
      1. 8.4.1 Commands
        1. 8.4.1.1 RREG: Read From Registers
        2. 8.4.1.2 WREG: Write To Registers
        3. 8.4.1.3 RESET: Device Reset
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Channel Seismic System
      2. 9.2.2 Four-Channel Seismic System
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.