SLASEH4 November   2023 DAC61401 , DAC81401

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
    7. 5.7  Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
    8. 5.8  Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
    9. 5.9  Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
    10. 5.10 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
    11. 5.11 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
    12. 5.12 Timing Diagrams
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 R-2R Ladder DAC
      3. 6.3.3 Programmable Gain Output Buffer
      4. 6.3.4 Sense Pins
      5. 6.3.5 DAC Register Structure
        1. 6.3.5.1 Output Update
        2. 6.3.5.2 Software Clear
          1. 6.3.5.2.1 Software Reset Mode
      6. 6.3.6 Internal Reference
      7. 6.3.7 Power-Supply Sequence
        1. 6.3.7.1 Power-On Reset (POR)
      8. 6.3.8 Thermal Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
    5. 6.5 Programming
      1. 6.5.1 Stand-Alone Operation
      2. 6.5.2 Daisy-Chain Operation
      3. 6.5.3 Frame Error Checking
  8. 7 Register Map
    1. 7.1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Key Components
        2. 8.2.2.2 Compensation Capacitor
        3. 8.2.2.3 Gain Stage
        4. 8.2.2.4 Attenuation and Buffer Stage
        5. 8.2.2.5 External Power Supply
        6. 8.2.2.6 Protection Design
        7. 8.2.2.7 Design Accuracy
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.4 Attenuation and Buffer Stage

To avoid any unintended I-R drop, connect VOUT and VSENSEP close to the load, and the voltage value for VSESNEP and VOUT must be same. Therefore, the gain stage output voltage is first buffered (U2) and then attenuated by a factor of 4 × with resistor divider R5 and R6.

VSENSEP has an input impedance of approximately 50 kῼ, and the resistor divider voltage cannot be connected directly, which causes erroneous voltage due to loading. This voltage output is first buffered (U3) and then connected to VSENSEP node of DAC81401 to close the internal feedback loop with VOUT.