SLVSFV5A july   2023  – july 2023 DRV8262

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
      1. 6.4.1 Transient Thermal Impedance & Current Capability
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Feature Description
    4. 7.4  Device Operational Modes
      1. 7.4.1 Dual H-Bridge Mode (MODE1 = 0)
      2. 7.4.2 Single H-Bridge Mode (MODE1 = 1)
    5. 7.5  Current Sensing and Regulation
      1. 7.5.1 Current Sensing and Feedback
      2. 7.5.2 Current Regulation
        1. 7.5.2.1 Mixed Decay
        2. 7.5.2.2 Smart tune Dynamic Decay
      3. 7.5.3 Current Sensing with External Resistor
    6. 7.6  Charge Pump
    7. 7.7  Linear Voltage Regulator
    8. 7.8  VCC Voltage Supply
    9. 7.9  Logic Level, Tri-Level and Quad-Level Pin Diagrams
    10. 7.10 Protection Circuits
      1. 7.10.1 VM Undervoltage Lockout (UVLO)
      2. 7.10.2 VCP Undervoltage Lockout (CPUV)
      3. 7.10.3 Logic Supply Power on Reset (POR)
      4. 7.10.4 Overcurrent Protection (OCP)
      5. 7.10.5 Thermal Shutdown (OTSD)
      6. 7.10.6 nFAULT Output
      7. 7.10.7 Fault Condition Summary
    11. 7.11 Device Functional Modes
      1. 7.11.1 Sleep Mode
      2. 7.11.2 Operating Mode
      3. 7.11.3 nSLEEP Reset Pulse
      4. 7.11.4 Functional Modes Summary
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving Brushed-DC Motors
        1. 8.1.1.1 Brushed-DC Motor Driver Typical Application
        2. 8.1.1.2 Power Loss Calculations - Dual H-bridge
        3. 8.1.1.3 Power Loss Calculations - Single H-bridge
        4. 8.1.1.4 Junction Temperature Estimation
        5. 8.1.1.5 Application Performance Plots
      2. 8.1.2 Driving Stepper Motors
        1. 8.1.2.1 Stepper Driver Typical Application
        2. 8.1.2.2 Power Loss Calculations
        3. 8.1.2.3 Junction Temperature Estimation
      3. 8.1.3 Driving Thermoelectric Coolers (TEC)
  10. Package Thermal Considerations
    1. 9.1 DDW Package
      1. 9.1.1 Thermal Performance
        1. 9.1.1.1 Steady-State Thermal Performance
        2. 9.1.1.2 Transient Thermal Performance
    2. 9.2 DDV Package
    3. 9.3 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The DRV8262 is a wide-voltage, high-power, H-bridge motor driver for a wide variety of industrial applications. The device integrates two H-bridges to drive two DC motors or a bipolar stepper motor. The H-bridges can be paralleled to drive one DC motor with higher current. The DRV8262 supports up to 16-A peak current in the dual H-bridge mode and up to 32-A in the single H-bridge mode. The device also integrates current sensing and regulation, current sense output and protection circuitry.

Integrated current sensing across the high-side MOSFETs allows the driver to regulate the motor current during startup and high load events. A current limit can be set with an adjustable external voltage reference. Additionally, the device provides output current proportional to the motor current for each H-bridge. The integrated sensing uses a current mirror, removing the need for large shunt resistors, saving board area and reducing system cost.

A low-power sleep mode is provided to achieve ultra- low quiescent current. Internal protection features are provided for supply undervoltage lockout (UVLO), charge pump undervoltage (CPUV), output over current (OCP), and device overtemperature (OTSD).

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE (2) BODY SIZE (NOM)
DRV8262DDWR HTSSOP-44 (bottom thermal pad) 14 mm × 8.1 mm 14 mm × 6.1 mm
DRV8262DDVR HTSSOP-44 (top thermal pad) 14 mm × 8.1 mm 14 mm × 6.1 mm
See the orderable addendum at the end of the data sheet.
The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20220608-SS0I-V8MN-J2PQ-JXPP3BWTDGHM-low.svg DRV8262 Simplified Schematic