SLVSBA2D July   2012  – May 2016 DRV8844

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Stage
      2. 7.3.2 Logic Inputs
      3. 7.3.3 Bridge Control
      4. 7.3.4 Charge Pump
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Thermal Shutdown (TSD)
        3. 7.3.5.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 nRESET and nSLEEP Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heatsinking
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VM Power supply voltage –0.3 65 V
Logic ground voltage (LGND) –0.5 VM - 8 V
Digital pin voltage LGND – 0.5 LGND + 7 V
SRC12, SRC34 (pins 6 and 9 with optional sense resistor) to VNEG pins (pins 14 and 28) –0.6 0.6 V
Peak motor drive output current, t < 1 μs Internally limited A
Continuous motor drive output current(2) 2.5 A
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Power dissipation and thermal limits must be observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range, all voltages relative to VNEG terminal (unless otherwise noted)
MIN NOM MAX UNIT
VM Motor power supply voltage(1) 8 60 V
IV3P3 V3P3OUT load current 0 10 mA
TA Ambient temperature –40 125 °C
(1) All VM pins must be connected to the same supply voltage.

6.4 Thermal Information

THERMAL METRIC(1) DRV8844 UNIT
PWP (HTSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 31.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.9 °C/W
RθJB Junction-to-board thermal resistance 5.6 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 5.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = 25°C, over operating free-air temperature range, all voltages relative to VNEG terminal (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES
IVM VM operating supply current VM = 24 V, fPWM < 50 kHz 1 5 mA
IVMQ VM sleep mode supply current VM = 24 V 500 800 μA
VUVLO VM undervoltage lockout voltage VM rising 6.3 8 V
V3P3OUT REGULATOR
V3P3 V3P3OUT voltage IOUT = 0 to 1 mA 3.18 3.3 3.52 V
LOGIC-LEVEL INPUTS
VIL Input low voltage LGND + 0.6 LGND + 0.7 V
VIH Input high voltage LGND + 2.2 LGND + 5.25 V
VHYS Input hysteresis 50 600 mV
IIL Input low current VIN = LGND –5 5 μA
IIH Input high current VIN = LGND + 3.3 V 100 μA
RPD Internal pulldown resistance 100 kΩ
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL Output low voltage IO = 5 mA LGND + 0.5 V
IOH Output high leakage current VO = LGND + 3.3 V 1 μA
H-BRIDGE FETS
RDS(ON) HS FET on resistance VM = 24 V, IO = 1 A, TJ = 25°C 0.24 Ω
VM = 24 V, IO = 1 A, TJ = 85°C 0.29 0.39
LS FET on resistance VM = 24 V, IO = 1 A, TJ = 25°C 0.24
VM = 24 V, IO = 1 A, TJ = 85°C 0.29 0.39
IOFF Off-state leakage current –2 2 μA
PROTECTION CIRCUITS
IOCP Overcurrent protection trip level 3 5 A
tDEAD Output dead time 90 ns
tOCP Overcurrent protection deglitch time 5 µs
TTSD Thermal shutdown temperature Die temperature 150 160 180 °C

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)(1) (see Figure 1)
NUMBER PARAMETER TEST CONDITIONS MIN MAX UNIT
1 t1 Delay time, ENx high to OUTx high, INx = 1 130 330 ns
2 t2 Delay time, ENx low to OUTx low, INx = 1 275 475 ns
3 t3 Delay time, ENx high to OUTx low, INx = 0 100 300 ns
4 t4 Delay time, ENx low to OUTx high, INx = 0 200 400 ns
5 t5 Delay time, INx high to OUTx high 300 500 ns
6 t6 Delay time, INx low to OUTx low 275 475 ns
7 tR Output rise time, resistive load to VNEG 30 150 ns
8 tF Output fall time, resistive load to VNEG 30 150 ns
(1) Not production tested – specified by design
DRV8844 switching_lvsba2.gif Figure 1. DRV8844 Switching Characteristics

6.7 Typical Characteristics

DRV8844 C001_SLVSBA2.gif
Figure 2. RDS(ON) vs Temperature
DRV8844 C003_SLVSBA2.gif
Figure 4. Sleep-Mode Current vs Temperature
DRV8844 C002_SLVSBA2.gif
Figure 3. Sleep-Mode Current vs VM