SNLS396D January   2012  – January 2016 DS100MB203

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics - Serial Management Bus Interface
    7. 6.7 Timing Requirements - Serial Bus Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Configuration Guidelines
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode
      2. 7.4.2 SMBUS Mode
    5. 7.5 Programming
      1. 7.5.1 SMBUS Master Mode
    6. 7.6 Register Maps
      1. 7.6.1 System Management Bus (SMBus) and Configuration Registers
        1. 7.6.1.1 Transfer of Data Through the SMBus
        2. 7.6.1.2 SMBus Transactions
        3. 7.6.1.3 Writing a Register
        4. 7.6.1.4 Reading a Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Recommendations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Bypassing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

  • Absolute Maximum Ratings for Soldering (SNOA549)
  • Understanding EEPROM Programming for High Speed Repeaters and Mux Buffers (SNLA228)
  • AN-1187 Leadless Leadframe Package (LLP) Application Report (SNOA401)

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.