SLVSEG9C May   2018  – February 2024 ESDS311 , ESDS312 , ESDS314

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 IEC 61000-4-4 EFT Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Signal Range
        2. 7.2.2.2 Operating Frequency
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1 IEC 61000-4-4 EFT Protection

The I/O pins of ESDS311, ESDS312, and ESDS314 can withstand surge events (IEC 61000-4-5, 8/20µs waveform) up to 25A and 170W. These devices also provide ESD protection up to ±30kV contact and ±30kV air gap per IEC 61000-4-2 standard. The I/O pins can withstand an electrical fast transient (EFT) burst of up to 80A (IEC 61000-4-4 5/50ns waveform, 4kV with 50Ω impedance). The capacitance between each I/O pin to ground is 4.5pF (typical) and 5.5pF (maximum). This device supports data rates up to 1Gbps.

The reverse DC breakdown voltage of each I/O pin is a minimum of 4.5V. This ensures that sensitive equipment is protected from surges above the reverse standoff voltage of 3.6V. The I/O pins feature an ultra-low leakage current of 100nA (maximum) with a bias of 3.6V. This device features an industrial operating range of –40°C to +125°C.