SLVSHJ6A December   2023  – February 2024 ESDS552

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1)ESDS552UNIT
DBZ (SOT-23)
3 PINS
RθJAJunction-to-ambient thermal resistance

244.1

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

107.4

°C/W
RθJBJunction-to-board thermal resistance

85.5

°C/W
ΨJTJunction-to-top characterization parameter

12.8

°C/W
ΨJBJunction-to-board characterization parameter

84.8

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.