SNLS582C June   2017  – September 2020 FPC402

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Host-Side Control Interface
      2. 8.3.2  LED Control
      3. 8.3.3  Low-Speed Output Signal Control
      4. 8.3.4  Low-Speed Input Status and Interrupt Generation
      5. 8.3.5  Downstream (Port-Side) I2C Master
      6. 8.3.6  Data Prefetch From Modules
      7. 8.3.7  Scheduled Write
      8. 8.3.8  Protocol Timeouts
      9. 8.3.9  General-Purpose Inputs and Outputs
      10. 8.3.10 Hot-Plug Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 I2C Host-Side Control Interface
      2. 8.4.2 SPI Host-Side Control Interface
        1. 8.4.2.1 SPI Frame Structure
        2. 8.4.2.2 SPI Read Operation
        3. 8.4.2.3 SPI Write Operation
    5. 8.5 Programming
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 SFP/QSFP Port Management
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Recommended Package Footprint
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Control Signal Management and I2C Aggregation Across Four Ports
  • Combine Multiple FPC402s to Control 56 Total Ports Through a Single Host Interface
  • Eliminate Need for Discrete I2C Muxes, LED Drivers, and High-Pin-Count FPGA/CPLD Control Devices
  • Reduce PCB Routing Complexity by Handling All Low-Speed Control Signals Close to the Port
  • Selectable I2C (up to 1 MHz) or SPI (up to 10 MHz) Host Control Interface
  • Automatic Prefetching of Critical, User-Specified Data From the Modules
  • Broadcast Mode Write to All Ports Simultaneously Across All FPC402 Controllers
  • Advanced LED Features for Port Status Indication, Including Programmable Blinking and Dimming
  • Customizable Interrupt Events
  • Separate Host-Side I/O Voltage: 1.8 V to 3.3 V
  • Small WQFN Package Enabling Placement on Bottom Side of PCB Underneath Ports