SLYS018E April   2018  – February 2024 INA181-Q1 , INA2181-Q1 , INA4181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 High Bandwidth and Slew Rate
      2. 7.3.2 Bidirectional Current Monitoring
      3. 7.3.3 Wide Input Common-Mode Voltage Range
      4. 7.3.4 Precise Low-Side Current Sensing
      5. 7.3.5 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3.      33
      4. 8.1.4 Summing Multiple Currents
      5. 8.1.5 Detecting Leakage Currents
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Common-Mode Transients Greater Than 26 V
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (November 2023) to Revision E (February 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed instances of INAx180 to INAx181 (typos)Go

Changes from Revision C (April 2020) to Revision D (November 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision B (March 2019) to Revision C (April 2020)

  • Added Functional Safety-Capable informationGo

Changes from Revision A (July 2018) to Revision B (March 2019)

  • Changed INA181-Q1 device from preview to production data (active)Go
  • Added new paragraph regarding phase reversal to end of Input Differential Overload sectionGo
  • Changed Figure 57 to fix pin number typosGo
  • Changed Figure 58 to fix pin number typos Go

Changes from Revision * (April 2018) to Revision A (July 2018)

  • Changed INA4181-Q1 device from preview to production data (active)Go
  • Changed instances of INAx180 to INAx181 in Pin Configurations and Functions (typos)Go