SBOS950A July   2019  – January 2021 INA253-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Integrated Shunt Resistor
      2. 7.3.2 Short-Circuit Duration
      3. 7.3.3 Temperature Stability
      4. 7.3.4 Enhanced PWM Rejection Operation
      5. 7.3.5 Input Signal Bandwidth
    4. 7.4 Device Functional Modes
      1. 7.4.1 Adjusting the Output Midpoint With the Reference Pins
      2. 7.4.2 Reference Pin Connections for Unidirectional Current Measurements
      3. 7.4.3 Ground Referenced Output
      4. 7.4.4 Reference Pin Connections for Bidirectional Current Measurements
        1. 7.4.4.1 Output Set to External Reference Voltage
      5. 7.4.5 Output Set to Mid-Supply Voltage
      6. 7.4.6 Output Set to Mid-External Reference
      7. 7.4.7 Output Set Using Resistor Divide
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Filtering
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  • This device is specified for current handling of up to 10 A over the entire –40 °C to +125 °C temperature range using a 1-oz copper pour for the input power plane, as well as no external airflow passing over the device.
  • The primary current-handling limitation for this device is how much heat is dissipated inside the package. Efforts to improve heat transfer out of the package and into the surrounding environment improve the ability of the device to handle currents of up to 15 A over the entire –40 °C to +125 °C temperature range.
  • Heat transfer improvements primarily involve larger copper power traces and planes with increased copper thickness (2 oz), as well as providing airflow to pass over the device. The INA253-Q1 evaluation module (EVM) features a 2-oz copper pour for the planes, and is capable of supporting 15 A at temperatures up to 125 °C.
  • Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.