SLLSF22G April   2018  – June 2020 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application Schematic
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics: Driver
    10. 8.10 Electrical Characteristics: Receiver
    11. 8.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 8.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 8.13 Switching Characteristics: Driver
    14. 8.14 Switching Characteristics: Receiver
    15. 8.15 Insulation Characteristics Curves
    16. 8.16 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 10.3.2 Failsafe Receiver
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Glitch-Free Power Up and Power Down
    4. 10.4 Device Functional Modes
      1. 10.4.1 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate and Bus Length
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Bus Loading
      3. 11.2.3 Application Curves
        1. 11.2.3.1 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 PCB Material
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Community Resource
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Power Ratings

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1410_ISO1412
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, A-B load = 54 Ω ||50pF, Load on R=15pF
Input a 250kHz 50% duty cycle square wave to D pin with VDE=VCC1, VRE=GND1		 556 mW
PD1 Maximum power dissipation (side-1) 28 mW
PD2 Maximum power dissipation (side-2) 528 mW
ISO1430_ISO1432
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, A-B load = 54 Ω ||50pF, Load on R=15pF
Input a 6MHz 50% duty cycle square wave to D pin with VDE=VCC1, VRE=GND1		 352 mW
PD1 Maximum power dissipation (side-1) 33 mW
PD2 Maximum power dissipation (side-2) 319 mW
ISO1450_ISO1452
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, A-B load = 54 Ω ||50pF, Load on R=15pF
Input a 25MHz 50% duty cycle square wave to D pin with VDE=VCC1, VRE=GND1		 588 mW
PD1 Maximum power dissipation (side-1) 49 mW
PD2 Maximum power dissipation (side-2) 539 mW