SLLSEA5C March   2012  – March 2019 ISO7421E-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Pin Configuration and Functions
    1. Table 1. Pin Functions
  5. 5 Electrostatic Discharge Caution
    1.     Device Images
      1. 5.1 Device Function Table
      2. 5.2 Available Options
  6. 6 Absolute Maximum Ratings
  7. 7 Thermal Information
  8. 8 Recommended Operating Conditions
  9. 9 Electrical Characteristics
  10. 10Switching Characteristics
  11. 11Electrical Characteristics
  12. 12Switching Characteristics
  13. 13Electrical Characteristics
  14. 14Switching Characteristics
  15. 15Electrical Characteristics
  16. 16Switching Characteristics
  17. 17Parameter Measurement Information
  18. 18Device Information
    1. 18.1 Package Characteristics
    2. 18.2 IEC 60664-1 Ratings Table
    3. 18.3 Insulation Characteristics
    4. 18.4 Regulatory Information
    5. 18.5 IEC Safety Limiting Values
    6. 18.6 Equivalent Input And Output Schematic Diagrams
  19. 19Typical Characteristics
  20. 20Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Thermal Information

THERMAL METRIC(1) ISO7421E-Q1 UNITS
DW (16 Pins)
θJA Junction-to-ambient thermal resistance 79.9 °C/W
θJCtop Junction-to-case (top) thermal resistance 44.6
θJB Junction-to-board thermal resistance 51.2
ψJT Junction-to-top characterization parameter 18.0
ψJB Junction-to-board characterization parameter 42.2
θJCbot Junction-to-case (bottom) thermal resistance n/a
PD Device power dissipation, Vcc1 = Vcc2 = 5.25 V, TJ = 150°C, CL = 15 pF, Input a 0.5 MHz 50% duty cycle square wave 42 mW
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).

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