SNVSA56B May 2015 – February 2017 LM2776
LM2776 power dissipation (PD) is calculated simply by subtracting output power from input power:
Power dissipation increases with increased input voltage and output current. Internal power dissipation self-heats the device. Dissipating this amount power/heat so the LM2776 does not overheat is a demanding thermal requirement for a small surface-mount package. When soldered to a PCB with layout conducive to power dissipation, the thermal properties of the SOT package enable this power to be dissipated from the LM2776 with little or no derating, even when the circuit is placed in elevated ambient temperatures when the output current is 200 mA or less.