SNVS422D August   2006  – September 2015 LM2831

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Theory of Operation
      2. 7.3.2 Soft Start
      3. 7.3.3 Output Overvoltage Protection
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2831X Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
          4. 8.2.1.2.4 Catch Diode
          5. 8.2.1.2.5 Output Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM2831X Design Example 2
      3. 8.2.3 LM2831X Design Example 3
      4. 8.2.4 LM2831Y Design Example 4
      5. 8.2.5 LM2831Y Design Example 5
      6. 8.2.6 LM2831Z Design Example 6
      7. 8.2.7 LM2831Z Design Example 7
      8. 8.2.8 LM2831X Dual Converters with Delayed Enabled Design Example 8
      9. 8.2.9 LM2831X Buck Converter and Voltage Double Circuit With LDO Follower Design Example 9
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Calculating Efficiency and Junction Temperature
      2. 10.1.2 Thermal Definitions
        1. 10.1.2.1 Silicon Junction Temperature Determination Method 1
      3. 10.1.3 WSON Package
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (April 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from B Revision (April 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo