SGLS178H August   2003  – October 2023 LM2902-Q1 , LM2902B-Q1 , LM2902BA-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configurations and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - LM2902B-Q1 and LM2902BA-Q1
    6. 6.6 Electrical Characteristics: LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1
    7. 6.7 Operating Conditions: LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Common Mode Range
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1 LM2902B-Q1, LM2902BA-Q1 UNIT
D (SOIC) PW (TSSOP) D (SOIC) PW (TSSOP)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 101 86 TBD 133.3 °C/W
RθJC Junction-to-case (top) thermal resistance — — TBD 63.4 °C/W
RθJB Junction-to-board thermal resistance — — TBD 76.5 °C/W
ψJT Junction-to-top characterization parameter — — TBD 15.6 °C/W
ψJB Junction-to-board characterization parameter — — TBD 75.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.