SNVSAX3 June   2017 LM337-N-MIL

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Thermal Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protection Diodes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Adjustable Negative Voltage Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Adjustable Lab Voltage Regulator
      3. 8.2.3 −5.2-V Regulator with Electronic Shutdown
      4. 8.2.4 High Stability −10-V Regulator
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heatsinking SOT-223 Package Parts
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

MIN MAX UNIT
Power dissipation Internally Limited
Input-output voltage differential –0.3 40 V
Operating junction temperature 0 125 °C
Storage temperature, Tstg –65 150 °C

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating junction temperature 0 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM337-N-MIL UNIT
NDT
(TO)		 DCY
(SOT-223)		 NDE OR NDG
(TO-220)
3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 140(2) 58.3 22.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 12 36.6 15.7 °C/W
RθJB Junction-to-board thermal resistance — 7.2 4.1 °C/W
ψJT Junction-to-top characterization parameter — 1.3 2.4 °C/W
ψJB Junction-to-board characterization parameter — 7 4.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — 1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) No heat sink.

6.5 Electrical Characteristics

Unless otherwise specified, these specifications apply: 0°C ≤ Tj ≤ 125°C for the LM337-N-MIL; VIN − VOUT = 5 V; and IOUT = 0.1 A for the TO package and IOUT = 0.5 A for the SOT-223 and TO-220 packages. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO and SOT-223, and 20 W for the TO-220. IMAX is 1.5 A for the SOT-223 and TO-220 packages, and 0.2 A for the TO package.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Line regulation TJ = 25°C, 3 V ≤ |VIN − VOUT| ≤ 40 V(1)
IL = 10 mA		 0.01 0.04 %/V
Load regulation TJ = 25°C, 10 mA ≤ IOUT ≤ IMAX 0.3% 1%
Thermal regulation TJ = 25°C, 10-ms Pulse 0.003 0.04 %/W
Adjustment pin current 65 100 μA
Adjustment pin current charge 10 mA ≤ IL ≤ IMAX
3 V ≤ |VIN − VOUT| ≤ 40 V,
TA = 25°C		 2 5 μA
Reference voltage 3 V ≤ |VIN − VOUT| ≤ 40 V, (2)
10 mA ≤ IOUT ≤ IMAX, P ≤ PMAX		 TJ = 25°C (2) −1.213 −1.25 −1.287 V
−55°C ≤ TJ ≤ 150°C −1.2 −1.25 −1.3 V
Line regulation 3 V ≤ |VIN − VOUT| ≤ 40 V, (1) 0.02 0.07 %/V
Load regulation 10 mA ≤ IOUT ≤ IMAX, (1) 0.3% 1.5%
Temperature stability TMIN ≤ Tj ≤ TMAX 0.6%
Minimum load current |VIN − VOUT| ≤ 40 V 2.5 10 mA
|VIN − VOUT| ≤ 10 V 1.5 6 mA
Current limit |VIN − VOUT| ≤ 15 V K, DCY and NDE package 1.5 2.2 3.7 A
NDT package 0.5 0.8 1.9 A
|VIN − VOUT| = 40 V, TJ = 25°C K, DCY and NDE package 0.15 0.4 A
NDT package 0.1 0.17 A
RMS output noise, % of VOUT Tj = 25°C, 10 Hz ≤ f ≤ 10 kHz 0.003%
Ripple rejection ratio VOUT = −10 V, f = 120 Hz 60 dB
CADJ = 10 μF 66 77 dB
Long-term stability TJ = 125°C, 1000 Hours 0.3% 1%
(1) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point ⅛ in. below the base of the TO packages.
(2) Selected devices with tightened tolerance reference voltage available.

6.6 Typical Characteristics

(NDE Package)
LM337-N-MIL 00906716.png Figure 1. Load Regulation
LM337-N-MIL 00906718.png Figure 3. Adjustment Current
LM337-N-MIL 00906720.png Figure 5. Temperature Stability
LM337-N-MIL 00906722.png Figure 7. Ripple Rejection
LM337-N-MIL 00906724.png Figure 9. Ripple Rejection
LM337-N-MIL 00906726.png Figure 11. Line Transient Response
LM337-N-MIL 00906717.png Figure 2. Current Limit
LM337-N-MIL 00906719.png Figure 4. Dropout Voltage
LM337-N-MIL 00906721.png Figure 6. Minimum Operating Current
LM337-N-MIL 00906723.png Figure 8. Ripple Rejection
LM337-N-MIL 00906725.png Figure 10. Output Impedance
LM337-N-MIL 00906727.png Figure 12. Load Transient Response