SNOS455G May   2000  – September 2015 LM4050-N , LM4050-N-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 2-V Option
    6. 6.6  Electrical Characteristics: 2.5-V Option
    7. 6.7  Electrical Characteristics: 4.1-V Option
    8. 6.8  Electrical Characteristics: 5-V Option
    9. 6.9  Electrical Characteristics: 8.2-V Option
    10. 6.10 Electrical Characteristics: 10-V Option
    11. 6.11 Typical Characteristics
      1. 6.11.1 Start-Up Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Shunt Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Precision Reference for an Analog-to-Digital Converter
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 VOUT Bounded Amplifier
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 VIN Bounded Amplifier
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 ±4.096 Precision Reference
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
      6. 9.2.6 ±1-mA Precision Current Sources
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LM4050-N is a precision micropower curvature-corrected bandgap shunt voltage reference. For space critical applications, the LM4050-N is available in the sub-miniature SOT-23 surface-mount package. The LM4050-N has been designed for stable operation without the need of an external capacitor connected between the + pin and the − pin. If, however, a bypass capacitor is used, the LM4050-N remains stable. Reducing design effort is the availability of several fixed reverse breakdown voltages: 2.048 V, 2.5 V, 4.096 V, 5 V, 8.192 V, and 10 V. The minimum operating current increases from 60 μA for the LM4050-N-2.0 to 100 μA for the LM4050-N-10.0. All versions have a maximum operating current of 15 mA.

LM4050-Ns in the SOT-23 packages have a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach interface contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2.

The 4.096-V version allows single 5-V 12-bit ADCs or DACs to operate with an LSB equal to 1 mV. For 12-bit ADCs or DACs that operate on supplies of 10 V or greater, the 8.192-V version gives 2 mV per LSB.

The typical thermal hysteresis specification is defined as the change in 25°C voltage measured after thermal cycling. The device is thermal cycled to temperature –40°C and then measured at 25°C. Next the device is thermal cycled to temperature 125°C and again measured at 25°C. The resulting VOUT delta shift between the 25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature and board mounting temperature are all factors that can contribute to thermal hysteresis.

In a conventional shunt regulator application (Figure 10) , an external series resistor (RS) is connected between the supply voltage and the LM4050-N. RS determines the current that flows through the load (IL) and the LM4050-N (IQ). Since load current and supply voltage may vary, RS should be small enough to supply at least the maximum guaranteed IRMIN (spec. table) to the LM4050-N even when the supply voltage is at its minimum and the load current is at its maximum value. When the supply voltage is at its maximum and IL is at its minimum, RS should be large enough so that the current flowing through the LM4050-N is less than 15 mA.

RS is determined by the supply voltage, (VS), the load and operating current, (IL and IQ), and the LM4050-N's reverse breakdown voltage, VR.

Equation 1. LM4050-N LM4050-N-Q1 10104526.gif

9.2 Typical Applications

9.2.1 Shunt Regulator

LM4050-N LM4050-N-Q1 shunt_regulator_schem_snos455.gif Figure 10. Shunt Regulator Schematic

9.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

DESIGN PARAMETER VALUE
Output Voltage 2 V, 2.5 V, 4.1 V, 5 V, 8.2 V, 10 V
Minimum Cathode Current 41 µA, 41 µA, 52 µA, 56 µA, 74 µA, 80 µA (Typical) (Respective to Above field)

9.2.1.2 Detailed Design Procedure

RS sets the cathode current of the shunt reference. Ensure that this current is greater than the minimum cathode current to ensure regulation and less that the maximum reverse current to prevent overheating of the shunt reference. A suggested good starting value for most designs is from approximately 0.5 mA to 1 mA.

Equation 2. LM4050-N LM4050-N-Q1 equation_19_snos455.gif

9.2.1.3 Application Curve

LM4050-N LM4050-N-Q1 10104512.png Figure 11. Reverse Characteristics and Minimum Operating Current

9.2.2 Precision Reference for an Analog-to-Digital Converter

LM4050-N LM4050-N-Q1 10104516.png
**Ceramic monolithic

*Tantalum
Figure 12. LM4050-N-4.1'S Nominal 4.096 Breakdown Voltage Gives ADC12451 1 MV/LSB

9.2.2.1 Design Requirements

For this design example, use the parameters listed in Table 2 as the input parameters.

Table 2. Design Parameters

DESIGN PARAMETER VALUE
Output Voltage 4.1 V

9.2.2.2 Detailed Design Procedure

Set IQ to approximately 1 mA.

Equation 3. LM4050-N LM4050-N-Q1 equation_20_snos455.gif

where

  • Rs = 900 Ω, nearest preferred Value = 909 Ω

9.2.3 VOUT Bounded Amplifier

LM4050-N LM4050-N-Q1 10104517.png
Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping voltage is ±11.5 V (LM4050-N's reverse breakdown voltage +2 diode VF).
Figure 13. Bounded Amplifier

9.2.3.1 Design Requirements

The only design requirement is VOUT bounded to ±11.5 V.

9.2.3.2 Detailed Design Procedure

Equation 4. LM4050-N LM4050-N-Q1 equation_03_snos455.gif
Equation 5. LM4050-N LM4050-N-Q1 equation_04_snos455.gif
Equation 6. LM4050-N LM4050-N-Q1 equation_05_snos455.gif

Set IQ to approximately 0.6 mA.

Equation 7. LM4050-N LM4050-N-Q1 equation_21_snos455.gif
Equation 8. LM4050-N LM4050-N-Q1 equation_22_snos455.gif

where

  • RS (total) = 33 kΩ (select 2 × 15 kΩ)

9.2.4 VIN Bounded Amplifier

LM4050-N LM4050-N-Q1 10104518.png
The bounding voltage is ±4 V with the LM4050-N-2.5 (LM4050-N's reverse breakdown voltage + 3 diode VF).
Figure 14. Protecting Op Amp Input

9.2.4.1 Design Requirements

The only design requirement is VIN bounded to ±4.6 V.

9.2.4.2 Detailed Design Procedure

Equation 9. LM4050-N LM4050-N-Q1 equation_08_snos455.gif
Equation 10. LM4050-N LM4050-N-Q1 equation_09_snos455.gif
Equation 11. LM4050-N LM4050-N-Q1 equation_10_snos455.gif

Set IQ to approximately 0.6 mA.

Equation 12. LM4050-N LM4050-N-Q1 equation_23_snos455.gif
Equation 13. LM4050-N LM4050-N-Q1 equation_24_snos455.gif

where

  • RS (total) = 12.5 kΩ (select 2 × 5 kΩ)

9.2.5 ±4.096 Precision Reference

LM4050-N LM4050-N-Q1 10104519.png Figure 15. Precision ±4.096v Reference

9.2.5.1 Design Requirements

The only design requirement is a positive and negative reference generated from a positive reference, ±4.096 V.

9.2.5.2 Detailed Design Procedure

Follow the design procedure set in Precision Reference for an Analog-to-Digital Converter.

9.2.6 ±1-mA Precision Current Sources

LM4050-N LM4050-N-Q1 10104521.png
LM4050-N LM4050-N-Q1 10104522.png
LM4050-N LM4050-N-Q1 equation_13_snos455.gif
Figure 16. Precision 1-µA to 1-mA Current Source (±)

9.2.6.1 Design Requirements

The only design requirement is a dual ±1-mA current source.

9.2.6.2 Detailed Design Procedure

Set worse-case cathode current to 0.6 mA.

Equation 14. LM4050-N LM4050-N-Q1 equation_14_snos455.gif
Equation 15. LM4050-N LM4050-N-Q1 equation_25_snos455.gif
Equation 16. LM4050-N LM4050-N-Q1 equation_26_snos455.gif
Equation 17. LM4050-N LM4050-N-Q1 equation_27_snos455.gif
Equation 18. LM4050-N LM4050-N-Q1 equation_18_snos455.gif