SNAS513F August   2011  – November 2015 LM48560

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics VDD = 3.6 V
    5. 6.5 I2C Interface Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 General Amplifier Function
      2. 8.3.2 Class H Operation
      3. 8.3.3 Differential Amplifier Explanation
      4. 8.3.4 Automatic Level Control (ALC)
      5. 8.3.5 Attack Time
      6. 8.3.6 Release Time
      7. 8.3.7 Boost Converter
      8. 8.3.8 Gain Setting
      9. 8.3.9 Shutdown Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Software or Hardware Mode
      2. 8.4.2 Single-Ended Input Configuration
    5. 8.5 Programming
      1. 8.5.1 Read/Write I2C Compatible Interface
      2. 8.5.2 Write Sequence
      3. 8.5.3 Read Sequence
    6. 8.6 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Proper Selection of External Components
          1. 9.2.2.1.1 ALC Timing (CSET) Capacitor Selection
          2. 9.2.2.1.2 Power Selection of External Components
          3. 9.2.2.1.3 Boost Converter Capacitor Selection
          4. 9.2.2.1.4 Inductor Selection
          5. 9.2.2.1.5 Diode Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due to trace resistance between the LM48560 device and the load results in decreased output power and efficiency. Trace resistance between the power supply and ground has the same effect as a poorly regulated supply, increased ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio signal. Use of power and ground planes is recommended.

Place all digital components and route digital signal traces as far as possible from analog components and traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines must cross either over or under each other, ensure that they cross in a perpendicular fashion.

11.2 Layout Example

LM48560 layout_example_snas513.gif Figure 30. PCB Layout Example