SNAS491B February   2010  – February 2018 LM48580

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VDD = 3.6 V
    6. 6.6 Typical Performance Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Class H Operation
      2. 8.3.2 Properties of Piezoelectric Elements
      3. 8.3.3 Differential Amplifier Explanation
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Gain Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Proper Selection of External Components
          1. 9.2.1.1.1 Boost Converter Capacitor Selection
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Boost Converter Output Capacitor Selection
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Diode Selection
        2. 9.2.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (May 2013) to B Revision

  • Added Device Information table, ESD table, Thermal Information table, Parameter Measurement Information, Feature Description, Device Functional Modes, Power Supply Recommendations, Layout section, Device and Documentation Support, and Mechanical, Packaging, and Orderable InformationGo
  • Deleted the Demoboard Bill of Materials sectionGo
  • Deleted the Demo Board Schematic sectionGo

Changes from * Revision (February 2010) to A Revision

  • Changed layout of National Data Sheet to TI format.Go