SNIS137G August   2004  – August 2019 LM95071

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Temperature Monitor Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics - Digital DC Characteristics
    7. 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Up and Power Down
      2. 8.3.2 Temperature Data Format
      3. 8.3.3 Tight Accuracy, Fine Resolution and Low Noise
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode/Manufacturer ID
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Interface
      2. 8.5.2 Serial Bus Timing Diagrams
    6. 8.6 Register Maps
      1. 8.6.1 Internal Register Structure
        1. 8.6.1.1 Configuration Register
        2. 8.6.1.2 Temperature Register
        3. 8.6.1.3 Manufacturer/Device ID Register
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Community Resource
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings (1)(4)(3)

MIN MAX UNIT
Supply voltage −0.3 6 V
Voltage at any pin −0.3 VDD + 0.3 V
Input current at any pin (2) 5 mA
Storage temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to 5 mA.
(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.
(4) Soldering process must comply with Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging.