SNOSB21D May   2008  – September 2016 LMH6518

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Preamplifier
        1. 7.3.1.1 Primary Output Amplifier
        2. 7.3.1.2 Auxiliary Amplifier
      2. 7.3.2 Overvoltage Clamp
      3. 7.3.3 Attenuator
      4. 7.3.4 Digital Control Block
    4. 7.4 Device Functional Modes
      1. 7.4.1 Primary Amplifier
      2. 7.4.2 Auxiliary Output
    5. 7.5 Programming
      1. 7.5.1 Logic Functions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Oscilloscope Front End
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Settings and ADC SPI Code (ECM)
          2. 8.2.1.2.2 Input and Output Considerations
            1. 8.2.1.2.2.1 Output Swing, Clamping, and Operation Beyond Full Scale
          3. 8.2.1.2.3 Oscilloscope Trigger Applications
        3. 8.2.1.3 Application Curves
      2. 8.2.2 JFET LNA Implementation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Attenuator Design
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (July 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added Thermal Information tableGo
  • Changed Y-axis unit on Output vs Input Typical Characteristics graphs From: (V) To: (mV)Go
  • Changed Y-axis unit on VOUT vs VIN Application Curves graph From: (V) To: (mV)Go

Changes from A Revision (March 2013) to B Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo