SNOS733Q April   2000  – November 2023 LP2980-N

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, ON/OFF pin tied to VIN, CIN = 1.0 µF, COUT = 2.2 µF for the legacy chip, and COUT = 4.7 µF for the new chip (unless otherwise noted)

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Figure 5-1 Output Voltage vs Temperature (Legacy Chip)
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Figure 5-3 Output Voltage vs VIN (Legacy Chip)
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Figure 5-5 Dropout Voltage vs VIN (New Chip)
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Figure 5-7 Dropout Voltage vs Temperature (Legacy Chip)
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Figure 5-9 Dropout Voltage vs Load Current (Legacy Chip)
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Figure 5-11 Ground Pin Current vs Temperature (Legacy Chip)
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Figure 5-13 Ground Pin Current vs Load Current (Legacy Chip)
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Figure 5-15 Input Current vs VIN (Legacy Chip)
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Figure 5-17 Short-Circuit Current vs Time (Legacy Chip)
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Figure 5-19 Short-Circuit Current vs Temperature (Legacy Chip)
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Figure 5-21 Short-Circuit Current vs Time (Legacy Chip)
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Figure 5-23 Output Impedance vs Frequency (Legacy Chip)
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Figure 5-25 Output Noise Density (Legacy Chip)
GUID-20231003-SS0I-2VCT-P62R-KWWQHQ5L2JN7-low.svg
VOUT = 3.3 V, COUT = 2.2 μF
Figure 5-27 Output Noise Density vs IOUT (New Chip)
GUID-20231003-SS0I-RHPC-BK44-QBQWLGCD4FRC-low.svg
VOUT = 3.3 V, IOUT = 50 mA
Figure 5-29 Ripple Rejection vs COUT (New Chip)
GUID-B5E6E60B-6C95-4B7C-A42B-282A7FDD671A-low.png
 
Figure 5-31 Input to Output Leakage vs Temperature (Legacy Chip)
GUID-20231003-SS0I-TTMN-GMJN-PGWNJPW4CT9X-low.svg
 
Figure 5-33 Output Reverse Leakage vs Temperature (New Chip)
GUID-20230912-SS0I-XWQQ-TDK9-6QR0S8KPQ8NW-low.svg
VOUT = 3.3 V, IOUT = 50 mA
Figure 5-35 Turn-On Waveform (New Chip)
GUID-20231010-SS0I-FJM4-9QQC-T3ST4C9ZTP5C-low.svg
VOUT = 3.3 V, IOUT = 50 mA
Figure 5-37 Turnoff Waveform (New Chip)
GUID-20231005-SS0I-1MMR-FPJK-VG1FCJBSSZDK-low.svg
VIN = 16 V
Figure 5-39 ON/OFF Pin Current vs VON/OFF (New Chip)
GUID-20231024-SS0I-RXQJ-R6R9-HF8WJKJRNGDH-low.svg
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-2 Output Voltage vs Temperature (New Chip)
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Figure 5-4 Output Voltage vs VIN (New Chip)
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Figure 5-6 Dropout Voltage vs VIN and Temperature (New Chip)
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Figure 5-8 Dropout Voltage vs Temperature (New Chip)
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Figure 5-10 Dropout Voltage vs Load Current (New Chip)
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Figure 5-12 Ground Pin Current vs Temperature (New Chip)
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Figure 5-14 Ground Pin Current vs Load Current (New Chip)
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Figure 5-16 Input Current vs Input Voltage (New Chip)
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VIN = 6 V
Figure 5-18 Short-Circuit Current vs Time (New Chip)
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Figure 5-20 Short-Circuit Current vs Temperature (New Chip)
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Figure 5-22 Short-Circuit Current vs Time (New Chip)
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Figure 5-24 Output Impedance vs Frequency (Legacy Chip)
GUID-20231003-SS0I-1WZC-KDMW-1VVF5LFGMVBV-low.svg
VOUT = 3.3 V, IOUT = 50 mA
Figure 5-26 Output Noise Density vs COUT (New Chip)
GUID-DADC7643-0D58-4919-A9EA-C3A32F874930-low.png
 
Figure 5-28 Ripple Rejection (Legacy Chip)
GUID-20231003-SS0I-DNFG-LDT6-T2555QN88GPC-low.svg
VOUT = 3.3 V, COUT = 2.2 μF
Figure 5-30 Ripple Rejection vs IOUT (New Chip)
GUID-02B629CF-ED06-48A3-8C8C-AC8EC80EFF54-low.png
 
Figure 5-32 Output Reverse Leakage vs Temperature (Legacy Chip)
GUID-6B7218AC-F3E6-4D80-8C1D-41047BCBF26B-low.png
 
Figure 5-34 Turn-On Waveform (Legacy Chip)
GUID-8891DB64-6C15-4EC7-9FD2-5D4EF0639913-low.png
 
Figure 5-36 Turnoff Waveform (Legacy Chip)
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Figure 5-38 ON/OFF Pin Current vs VON/OFF (Legacy Chip)
GUID-20231010-SS0I-BCBK-RDXB-KPSD6CHNCDPD-low.svg
VIN = 4.3 V
Figure 5-40 ON/OFF Pin Current vs VON/OFF (New Chip)