SNVS539H November   2007  – September 2015 LP38500-ADJ , LP38502-ADJ

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configurations and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Stability And Phase Margin
      2. 7.3.2 Load Transient Response
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Short-Circuit Protection
      2. 7.4.2 Enable Operation (LP38502-ADJ Only)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Setting The Output Voltage
        5. 8.2.2.5 RFI/EMI Susceptibility
        6. 8.2.2.6 Output Noise
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Dissipation/Heatsinking
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed Circuit Board Layout
    2. 10.2 Layout Examples
      1. 10.2.1 Heatsinking WSON Package
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.