SNVS539H November   2007  – September 2015 LP38500-ADJ , LP38502-ADJ

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configurations and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Stability And Phase Margin
      2. 7.3.2 Load Transient Response
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Short-Circuit Protection
      2. 7.4.2 Enable Operation (LP38502-ADJ Only)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Setting The Output Voltage
        5. 8.2.2.5 RFI/EMI Susceptibility
        6. 8.2.2.6 Output Noise
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Dissipation/Heatsinking
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed Circuit Board Layout
    2. 10.2 Layout Examples
      1. 10.2.1 Heatsinking WSON Package
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configurations and Functions

KTT Package (LP38500)
5-Pin DDPAK/TO-263
Top View
LP38500-ADJ LP38502-ADJ 30036121.png
KTT Package (LP38502)
5-Pin DDPAK/TO-263
Top View
LP38500-ADJ LP38502-ADJ 30036122.png
NDQ Package (LP38500)
5-Pin TO-263
Top View
LP38500-ADJ LP38502-ADJ 30036163.png
NDQ Package (LP38502)
5-Pin TO-263
Top View
LP38500-ADJ LP38502-ADJ 30036162.png
NGS Package (LP38500A)
8-Pin WSON
Top View
LP38500-ADJ LP38502-ADJ 30036159.png
NGS Package (LP38502A)
8-Pin WSON
Top View
LP38500-ADJ LP38502-ADJ 30036160.png

Pin Functions

PIN TYPE DESCRIPTION
NAME KTT NDQ NGS
ADJ 5 5 8 O Sets output voltage
EN 1 1 2 I Enable (LP38502-ADJ only). Pull high to enable the output, low to disable the output. This pin has no internal bias and must be either tied to the input voltage, or actively driven.
GND 3 3 1 G Ground
IN 2 I Input supply (LP38500-ADJ only). Input supply pins share current and must be connected together on the PC board.
IN 2 2 3, 4 I Input supply. Input Supply pins share current and must be connected together on the PC board.
N/C 1 1 In the LP38500-ADJ, this pin has no internal connections. It can be left floating or used for trace routing.
OUT 4 4 5, 6, 7 O Regulated output voltage. Output pins share current and must be connected together on the PC board.
DAP The DAP is used to remove heat from the device by conducting it to a copper clad area on the PCB which acts as a heatsink. The DAP is electrically connected to the backside of the die. The DAP must be connected to ground potential, but can not be used as the only ground connection.